Abstract
Al2O3 is a broadly employed dielectric material in GaN high electron mobility transistors. Nevertheless, at the Al2O3/GaN interface, numerous traps induced by nonidealities of the native GaO x layer on the surface of GaN can lead to threshold voltage instability and other reliability issues. In this study, after removing the native GaO x layer, a stoichiometric Ga2O3 layer was sandwiched between Al2O3 and GaN. The interfacial state density of Al2O3/GaN can be reduced by more than two orders of magnitude to an extremely low level of 2.4 × 1010 eV-1 cm-2 at the energy level of 0.36 eV.
Original language | English (US) |
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Article number | 060906 |
Journal | Japanese Journal of Applied Physics |
Volume | 61 |
Issue number | 6 |
DOIs | |
State | Published - Jun 1 2022 |
Bibliographical note
Publisher Copyright:© 2022 The Author(s). Published on behalf of The Japan Society of Applied Physics by IOP Publishing Ltd.
Keywords
- GaN HEMTs
- interfacial state density
- stoichiometric Ga2O3 interlayer
ASJC Scopus subject areas
- General Engineering
- General Physics and Astronomy