High efficiency 850 nm vertical-cavity surface-emitting laser using fan-pad metallization and trench patterning

Mohd Sharizal Alias; Paul O. Leisher; Kent D. Choquette; Sahbuddin Shaari

doi:10.1109/IEMT.2008.5507777

High efficiency 850 nm vertical-cavity surface-emitting laser using fan-pad metallization and trench patterning

Mohd Sharizal Alias, Paul O. Leisher, Kent D. Choquette, Sahbuddin Shaari

Research output: Contribution to journal › Conference article › peer-review

Abstract

In this paper, fan-pad metallization and trench patterning were introduced in 850 nm Vertical-Cavity Surface-Emitting Laser (VCSEL) device packaging. Low threshold current and series resistance, which contributes to higher VCSEL efficiency, are obtained for the VCSEL with fan-metallization and trench patterning fabricated devices. Further, the output spectral characteristics show stable multimode operation for these devices. The results indicate that the proposed VCSEL packaging exhibits superior device performance compared to typical packaged VCSEL with square-pad metal.

Original language	English (US)
Article number	5507777
Journal	Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
DOIs	https://doi.org/10.1109/IEMT.2008.5507777
State	Published - 2008
Externally published	Yes
Event	2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008 - Penang, Malaysia Duration: Nov 4 2008 → Nov 6 2008

ASJC Scopus subject areas

Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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10.1109/IEMT.2008.5507777

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title = "High efficiency 850 nm vertical-cavity surface-emitting laser using fan-pad metallization and trench patterning",

abstract = "In this paper, fan-pad metallization and trench patterning were introduced in 850 nm Vertical-Cavity Surface-Emitting Laser (VCSEL) device packaging. Low threshold current and series resistance, which contributes to higher VCSEL efficiency, are obtained for the VCSEL with fan-metallization and trench patterning fabricated devices. Further, the output spectral characteristics show stable multimode operation for these devices. The results indicate that the proposed VCSEL packaging exhibits superior device performance compared to typical packaged VCSEL with square-pad metal.",

author = "Alias, {Mohd Sharizal} and Leisher, {Paul O.} and Choquette, {Kent D.} and Sahbuddin Shaari",

year = "2008",

doi = "10.1109/IEMT.2008.5507777",

language = "English (US)",

journal = "Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium",

issn = "1089-8190",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008 ; Conference date: 04-11-2008 Through 06-11-2008",

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T1 - High efficiency 850 nm vertical-cavity surface-emitting laser using fan-pad metallization and trench patterning

AU - Alias, Mohd Sharizal

AU - Leisher, Paul O.

AU - Choquette, Kent D.

AU - Shaari, Sahbuddin

PY - 2008

Y1 - 2008

N2 - In this paper, fan-pad metallization and trench patterning were introduced in 850 nm Vertical-Cavity Surface-Emitting Laser (VCSEL) device packaging. Low threshold current and series resistance, which contributes to higher VCSEL efficiency, are obtained for the VCSEL with fan-metallization and trench patterning fabricated devices. Further, the output spectral characteristics show stable multimode operation for these devices. The results indicate that the proposed VCSEL packaging exhibits superior device performance compared to typical packaged VCSEL with square-pad metal.

AB - In this paper, fan-pad metallization and trench patterning were introduced in 850 nm Vertical-Cavity Surface-Emitting Laser (VCSEL) device packaging. Low threshold current and series resistance, which contributes to higher VCSEL efficiency, are obtained for the VCSEL with fan-metallization and trench patterning fabricated devices. Further, the output spectral characteristics show stable multimode operation for these devices. The results indicate that the proposed VCSEL packaging exhibits superior device performance compared to typical packaged VCSEL with square-pad metal.

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U2 - 10.1109/IEMT.2008.5507777

DO - 10.1109/IEMT.2008.5507777

M3 - Conference article

AN - SCOPUS:77955123132

SN - 1089-8190

JO - Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

JF - Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

M1 - 5507777

T2 - 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008

Y2 - 4 November 2008 through 6 November 2008

ER -

High efficiency 850 nm vertical-cavity surface-emitting laser using fan-pad metallization and trench patterning

Abstract

ASJC Scopus subject areas

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