Abstract
This paper describes a process which uses a multilayered reactive foil to hermetically seal microelectronic packages. The foil is comprised of thousands of nanoscale layers of elements with large negative heats of mixing, such as Al and Ni. When the reaction is activated in the foil using a small electrical or thermal stimulus, the heat generated melts the adjoining solder layers and permanently joins the package lid to the base. The seal is achieved without exposing the components to high reflow temperature. RNT has used this process to create a hermetic seal between an Au-plated stainless steel lid and Au-plated stainless steel base. We show that helium leak rates of less than 1 × 10-10 atm-cc/sec can be achieved by using this method. This process provides an attractive alternative to more expensive methods such as laser welding and eliminates the need for costly fabrication equipment.
Original language | English (US) |
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Title of host publication | Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005 |
Pages | 286-290 |
Number of pages | 5 |
State | Published - 2005 |
Externally published | Yes |
Event | 38th International Symposium on Microelectronics, IMAPS 2005 - Philadelphia, PA, United States Duration: Sep 25 2005 → Sep 29 2005 |
Other
Other | 38th International Symposium on Microelectronics, IMAPS 2005 |
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Country/Territory | United States |
City | Philadelphia, PA |
Period | 09/25/05 → 09/29/05 |
Keywords
- Flux free
- Hermetic sealing
- Reactive multilayer foil
- Room temperature process
ASJC Scopus subject areas
- Electrical and Electronic Engineering