Abstract
This paper investigates the use of plasma nitridation (PN) for fabricating 1.5 and 2 nm gate dielectrics for CMOS system-on-a-chip (SoC) applications. The separate optimisation of PN recipes for high performance (HP, 1.5 nm) and low power (LP, 2 nm) CMOS devices results in good device performance with excellent device lifetime and low 1/f noise. For tripleoxide SoC applications, the use of a common PN step for both HP and LP yields gate dielectrics with excellent breakdown characteristics and devices with the required off-state leakage control.
Original language | English (US) |
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Title of host publication | European Solid-State Device Research Conference |
Publisher | IEEE Computer Society |
Pages | 427-430 |
Number of pages | 4 |
ISBN (Electronic) | 8890084782 |
DOIs | |
State | Published - 2002 |
Externally published | Yes |
Event | 32nd European Solid-State Device Research Conference, ESSDERC 2002 - Firenze, Italy Duration: Sep 24 2002 → Sep 26 2002 |
Other
Other | 32nd European Solid-State Device Research Conference, ESSDERC 2002 |
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Country/Territory | Italy |
City | Firenze |
Period | 09/24/02 → 09/26/02 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Safety, Risk, Reliability and Quality