Flexible nanoscale high-performance FinFETs

Galo T. Sevilla, Mohamed T. Ghoneim, Hossain M. Fahad, Jhonathan Prieto Rojas, Aftab M. Hussain, Muhammad Mustafa Hussain

Research output: Contribution to journalArticlepeer-review

61 Scopus citations


With the emergence of the Internet of Things (IoT), flexible high-performance nanoscale electronics are more desired. At the moment, FinFET is the most advanced transistor architecture used in the state-of-the-art microprocessors. Therefore, we show a soft-etch based substrate thinning process to transform silicon-on-insulator (SOI) based nanoscale FinFET into flexible FinFET and then conduct comprehensive electrical characterization under various bending conditions to understand its electrical performance. Our study shows that back-etch based substrate thinning process is gentler than traditional abrasive back-grinding process; it can attain ultraflexibility and the electrical characteristics of the flexible nanoscale FinFET show no performance degradation compared to its rigid bulk counterpart indicating its readiness to be used for flexible high-performance electronics.
Original languageEnglish (US)
Pages (from-to)9850-9856
Number of pages7
JournalACS Nano
Issue number10
StatePublished - Sep 5 2014

Bibliographical note

KAUST Repository Item: Exported on 2020-10-01
Acknowledgements: We acknowledge the support from MUST OCRF Competitive Research Grant: CRG-1-2012-HUS-008 for this work.

ASJC Scopus subject areas

  • General Physics and Astronomy
  • General Materials Science
  • General Engineering


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