TY - JOUR
T1 - Flexible Lightweight CMOS-Enabled Multisensory Platform for Plant Microclimate Monitoring
AU - Khan, Sherjeel M.
AU - Shaikh, Sohail F.
AU - Qaiser, Nadeem
AU - Hussain, Muhammad Mustafa
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2018/10/9
Y1 - 2018/10/9
N2 - We report an ultralightweight flexible sensory platform using bare die CMOS chips having a light, temperature, and humidity sensor on a flexible polymer substrate. An application-specified integrated circuit designed and fabricated in a 0.35-μm process is used for signal acquisition, conditioning, and further transfer of data to a bare die microcontroller. The whole platform is powered by a bare die solid-state battery. This extremely lightweight (0.44 g), compact (3 x 1.5 cm²), flexible, and mostly transparent platform can be unobtrusively placed on a leaf of a plant to monitor microclimate conditions surrounding a plant for accurate plant growth monitoring. The latter is successfully demonstrated by placing the platform on a plant leaf and monitoring changing environmental conditions (light, temperature, and humidity) for a whole day.
AB - We report an ultralightweight flexible sensory platform using bare die CMOS chips having a light, temperature, and humidity sensor on a flexible polymer substrate. An application-specified integrated circuit designed and fabricated in a 0.35-μm process is used for signal acquisition, conditioning, and further transfer of data to a bare die microcontroller. The whole platform is powered by a bare die solid-state battery. This extremely lightweight (0.44 g), compact (3 x 1.5 cm²), flexible, and mostly transparent platform can be unobtrusively placed on a leaf of a plant to monitor microclimate conditions surrounding a plant for accurate plant growth monitoring. The latter is successfully demonstrated by placing the platform on a plant leaf and monitoring changing environmental conditions (light, temperature, and humidity) for a whole day.
UR - http://hdl.handle.net/10754/629335
UR - https://ieeexplore.ieee.org/document/8486710
UR - http://www.scopus.com/inward/record.url?scp=85054671100&partnerID=8YFLogxK
U2 - 10.1109/ted.2018.2872401
DO - 10.1109/ted.2018.2872401
M3 - Article
SN - 0018-9383
VL - 65
SP - 1
EP - 7
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
IS - 11
ER -