Abstract
In today's digital age, the increasing dependence on information also makes us vulnerable to potential invasion of privacy and cyber security. Consider a scenario in which a hard drive is stolen, lost, or misplaced, which contains secured and valuable information. In such a case, it is important to have the ability to remotely destroy the sensitive part of the device (e.g., memory or processor) if it is not possible to regain it. Many emerging materials and even some traditional materials like silicon, aluminum, zinc oxide, tungsten, and magnesium, which are often used for logic processor and memory, show promise to be gradually dissolved upon exposure of various liquid medium. However, often these wet processes are too slow, fully destructive, and require assistance from the liquid materials and their suitable availability at the time of need. This study shows Joule heating effect induced thermal expansion and stress gradient between thermally expandable advanced polymeric material and flexible bulk monocrystalline silicon (100) to destroy high-performance solid state electronics as needed and under 10 s. This study also shows different stimuli-assisted smartphone-operated remote destructions of such complementary metal oxide semiconductor electronics.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1600264 |
| Journal | Advanced Materials Technologies |
| Volume | 2 |
| Issue number | 5 |
| DOIs | |
| State | Published - Mar 29 2017 |
Bibliographical note
KAUST Repository Item: Exported on 2020-10-01Acknowledged KAUST grant number(s): GEN-01-4014, OSR-2015-Sensors-2707, OSR-2016-KKI-2880
Acknowledgements: This publication was based upon work supported by the King Abdullah University of Science and Technology (KAUST) Technology Transfer Office (TTO) under Award No. Proof of Concept GEN-01-4014, Office of Sponsored Research (OSR) under Award No. Sensor Innovation Initiative OSR-2015-Sensors-2707 and KAUST-KFUPM Special Initiative OSR-2016-KKI-2880. A.G., A.A., and A.M.H. contributed equally to this work. M.M.H. conceptualized the study. A.G. led and carried the study (materials, design, processes, device, integration, characterization, and data analysis). A.A. carried out all FEA analysis. A.G., A.A., and A.M.H. developed all the devices. K.M. and I.W. developed all the circuitry. G.A.T.S. developed the software and app. M.D. supported packaging. S.F.S., S.V., S.M.A., and M.T.G. assisted in characterization. Every author reviewed the manuscript independently, provided feedback, and approved the final version.