Evaluating the impact of resistance in carbon nanotube bundles for VLSI interconnect using diameter-dependent modeling techniques

Engineering

• Applications 40%
• Carbon Nanotubes 40%
• Copper 40%
• Electromigration 20%
• Error 20%
• Experimental Result 20%
• Interconnects 100%
• Models 60%
• Nanotubes 80%
• Ohmic Resistance 20%
• Reduction 20%
• Single-Walled Carbon Nanotube 40%

Nursing and Health Professions

• Carbon Nanotube 40%
• Copper 40%
• Electric Potential 20%
• Error 20%
• Nanotube 80%
• Procedures 20%
• Single Walled Nanotube 40%

Medicine and Dentistry

• Carbon Nanotube 40%
• Copper 40%
• Nanotube 80%
• Single Walled Nanotube 40%