Erosion resistance of polycrystalline diamond films to atomic oxygen

Jingqi Li*, Qing Zhang, S. F. Yoon, J. Ahn, Qiang Zhou, Sigen Wang, Dajiang Yang, Qiang Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Scopus citations


Polycrystalline diamond films deposited using hot filament chemical vapor deposition (CVD) technique have been investigated in atomic oxygen simulated as low earth orbit environment to examine their erosion resistance properties. After exposure to the atomic oxygen beam with a flux of 2.6×1016 atoms/cm2 s, the diamond films only show a small mass loss. The reaction efficiency is estimated to be between 6.35×10-26 and 8.28×10-26 cm3/atom. Oxidation mechanism is investigated through the reaction temperature influence on the reaction rate. We suggest that atomic oxygen reacts with diamond surface and forms ether (C-O-C) and carbonyl (>C=O) configurations besides eroding the surface.

Original languageEnglish (US)
Pages (from-to)1847-1850
Number of pages4
Issue number9
StatePublished - 2003
Externally publishedYes


  • A. Diamond
  • B. Oxidation
  • C. Surface oxygen complex
  • D. Reactivity

ASJC Scopus subject areas

  • General Chemistry
  • General Materials Science


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