Abstract
We propose a new method to improve resistive switching properties in HfO2 based CBRAM crossbar structure device by introducing a TaN thin diffusion blocking layer between the Cu top electrode and HfO2 switching layer. The Cu/TaN/HfO2/TiN device structure exhibits high resistance ratio of OFF/ON states without any degradation in switching during endurance test. The improvement in the endurance properties of the Cu/TaN/HfO2/TiN CBRAM device is thus attributed to the relatively low amount of Cu migration into HfO2 switching layer.
Original language | English (US) |
---|---|
Pages (from-to) | 1971-1976 |
Number of pages | 6 |
Journal | ECS Transactions |
Volume | 77 |
Issue number | 11 |
DOIs | |
State | Published - Aug 4 2017 |
Bibliographical note
KAUST Repository Item: Exported on 2020-10-01Acknowledgements: This work is supported by the Nanofabrication Core Laboratories at King Abdullah University of Science and Technology, Saudi Arabia.