Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits

Lei Wang; Manxiang Wang; Jinrong Lu; Ryanda Enggar Anugrah Ardhi; Jing Liu; Guicheng Liu; Joong Kee Lee

doi:10.1016/j.jtice.2018.07.003

Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits

Lei Wang, Manxiang Wang, Jinrong Lu, Ryanda Enggar Anugrah Ardhi, Jing Liu^*, Guicheng Liu, Joong Kee Lee

^*Corresponding author for this work

Material Science and Engineering

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

Abstract

Liquid metal (In_75.4 Ga_24.5, LM) with its high electrical conductivity and flexibility at room temperature, has been gradually introduced into printed electronics. However, the low adhesion effect of LM on the common printer paper may restrict its potential value in reducing cost and expanding use. In this study, the surface property of the printer paper has been modified by a wetting method with a coating of micro-size droplets on the paper surface to realize a smooth writing process using the liquid metal ink. The current strategy is expected to enable future flexible electronic circuits on the hard writing substrates.

Original language	English (US)
Pages (from-to)	202-207
Number of pages	6
Journal	Journal of the Taiwan Institute of Chemical Engineers
Volume	95
DOIs	https://doi.org/10.1016/j.jtice.2018.07.003
State	Published - Feb 2019

Bibliographical note

Funding Information:
This work was supported by China Postdoctoral Science Foundation Grant (2016M590137), Beijing Municipal Science (Z151100003715002) and Key Project Funding of Chinese Academy of Sciences, the framework of international cooperation program managed by the National Research Foundation of Korea (NRF-2017K2A9A2A06015754, FY2017), and KIST Institutional Program (2E28141).

Funding Information:
This work was supported by China Postdoctoral Science Foundation Grant ( 2016M590137 ), Beijing Municipal Science (Z151100003715002) and Key Project Funding of Chinese Academy of Sciences, the framework of international cooperation program managed by the National Research Foundation of Korea ( NRF-2017K2A9A2A06015754 , FY2017 ), and KIST Institutional Program (2E28141).

Publisher Copyright:
© 2018 Taiwan Institute of Chemical Engineers

Keywords

Direct writing
Liquid metal
Printed electronics
Printer paper
Wetting processing

ASJC Scopus subject areas

General Chemistry
General Chemical Engineering

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10.1016/j.jtice.2018.07.003

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title = "Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits",

abstract = "Liquid metal (In75.4 Ga24.5, LM) with its high electrical conductivity and flexibility at room temperature, has been gradually introduced into printed electronics. However, the low adhesion effect of LM on the common printer paper may restrict its potential value in reducing cost and expanding use. In this study, the surface property of the printer paper has been modified by a wetting method with a coating of micro-size droplets on the paper surface to realize a smooth writing process using the liquid metal ink. The current strategy is expected to enable future flexible electronic circuits on the hard writing substrates.",

keywords = "Direct writing, Liquid metal, Printed electronics, Printer paper, Wetting processing",

author = "Lei Wang and Manxiang Wang and Jinrong Lu and Ardhi, {Ryanda Enggar Anugrah} and Jing Liu and Guicheng Liu and Lee, {Joong Kee}",

note = "Funding Information: This work was supported by China Postdoctoral Science Foundation Grant (2016M590137), Beijing Municipal Science (Z151100003715002) and Key Project Funding of Chinese Academy of Sciences, the framework of international cooperation program managed by the National Research Foundation of Korea (NRF-2017K2A9A2A06015754, FY2017), and KIST Institutional Program (2E28141). Funding Information: This work was supported by China Postdoctoral Science Foundation Grant ( 2016M590137 ), Beijing Municipal Science (Z151100003715002) and Key Project Funding of Chinese Academy of Sciences, the framework of international cooperation program managed by the National Research Foundation of Korea ( NRF-2017K2A9A2A06015754 , FY2017 ), and KIST Institutional Program (2E28141). Publisher Copyright: {\textcopyright} 2018 Taiwan Institute of Chemical Engineers",

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AU - Ardhi, Ryanda Enggar Anugrah

AU - Liu, Jing

AU - Liu, Guicheng

AU - Lee, Joong Kee

N1 - Funding Information: This work was supported by China Postdoctoral Science Foundation Grant (2016M590137), Beijing Municipal Science (Z151100003715002) and Key Project Funding of Chinese Academy of Sciences, the framework of international cooperation program managed by the National Research Foundation of Korea (NRF-2017K2A9A2A06015754, FY2017), and KIST Institutional Program (2E28141). Funding Information: This work was supported by China Postdoctoral Science Foundation Grant ( 2016M590137 ), Beijing Municipal Science (Z151100003715002) and Key Project Funding of Chinese Academy of Sciences, the framework of international cooperation program managed by the National Research Foundation of Korea ( NRF-2017K2A9A2A06015754 , FY2017 ), and KIST Institutional Program (2E28141). Publisher Copyright: © 2018 Taiwan Institute of Chemical Engineers

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AB - Liquid metal (In75.4 Ga24.5, LM) with its high electrical conductivity and flexibility at room temperature, has been gradually introduced into printed electronics. However, the low adhesion effect of LM on the common printer paper may restrict its potential value in reducing cost and expanding use. In this study, the surface property of the printer paper has been modified by a wetting method with a coating of micro-size droplets on the paper surface to realize a smooth writing process using the liquid metal ink. The current strategy is expected to enable future flexible electronic circuits on the hard writing substrates.

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KW - Liquid metal

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KW - Wetting processing

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ER -

Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

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