Engineering kinetic barriers in copper metallization

Hanchen Huang; H. L. Wei; C. H. Woo; X. X. Zhang

doi:10.1063/1.1527226

Engineering kinetic barriers in copper metallization

Hanchen Huang^*, H. L. Wei, C. H. Woo, X. X. Zhang

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

25 Scopus citations

Abstract

The method to improve quality of deposited copper films was discussed by using magnetron sputtering technique. The structure and texture of the film was characterized by using the SEM and X-ray diffraction analysis. The results showed that the quality of the film was improved by the reduction of three dimensional Ehrlich-Schwoebel barrier.

Original language	English (US)
Pages (from-to)	4359-4361
Number of pages	3
Journal	Applied Physics Letters
Volume	81
Issue number	23
DOIs	https://doi.org/10.1063/1.1527226
State	Published - Dec 2 2002
Externally published	Yes

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

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10.1063/1.1527226

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@article{8a48d50e424a40d8a8477c185c5c923f,

title = "Engineering kinetic barriers in copper metallization",

abstract = "The method to improve quality of deposited copper films was discussed by using magnetron sputtering technique. The structure and texture of the film was characterized by using the SEM and X-ray diffraction analysis. The results showed that the quality of the film was improved by the reduction of three dimensional Ehrlich-Schwoebel barrier.",

author = "Hanchen Huang and Wei, {H. L.} and Woo, {C. H.} and Zhang, {X. X.}",

year = "2002",

month = dec,

day = "2",

doi = "10.1063/1.1527226",

language = "English (US)",

volume = "81",

pages = "4359--4361",

journal = "Applied Physics Letters",

issn = "0003-6951",

publisher = "AMER INST PHYSICS",

number = "23",

}

TY - JOUR

T1 - Engineering kinetic barriers in copper metallization

AU - Huang, Hanchen

AU - Wei, H. L.

AU - Woo, C. H.

AU - Zhang, X. X.

PY - 2002/12/2

Y1 - 2002/12/2

N2 - The method to improve quality of deposited copper films was discussed by using magnetron sputtering technique. The structure and texture of the film was characterized by using the SEM and X-ray diffraction analysis. The results showed that the quality of the film was improved by the reduction of three dimensional Ehrlich-Schwoebel barrier.

AB - The method to improve quality of deposited copper films was discussed by using magnetron sputtering technique. The structure and texture of the film was characterized by using the SEM and X-ray diffraction analysis. The results showed that the quality of the film was improved by the reduction of three dimensional Ehrlich-Schwoebel barrier.

UR - http://www.scopus.com/inward/record.url?scp=0037011601&partnerID=8YFLogxK

U2 - 10.1063/1.1527226

DO - 10.1063/1.1527226

M3 - Article

AN - SCOPUS:0037011601

SN - 0003-6951

VL - 81

SP - 4359

EP - 4361

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 23

ER -

Engineering kinetic barriers in copper metallization

Abstract

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