Dynamical integrity for interpreting experimental data and ensuring safety in electrostatic MEMS

Laura Ruzziconi*, Mohammad I. Younis, Stefano Lenci

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

17 Scopus citations

Abstract

A dynamical integrity analysis is performed for an electrostatic microelectro- mechanical system (MEMS) device. The analysis starts from the experimental data of dynamic pull-in due to a frequency-sweeping process in a capacitive accelerometer. The loss of dynamical integrity is investigated by curves of constant percentage of integrity factor. We found that these curves follow exactly the experimental data and succeed in interpreting the existence of disturbances. On the other hand, instead, the theoretical curves of disappearance of the attractors represent the limit when disturbances are absent, which never occurs in practice. Also, the obtained behavior chart can serve as a design guideline in order to ensure safety of the device.

Original languageEnglish (US)
Title of host publicationIUTAM Symposium on Nonlinear Dynamics for Advanced Technologies and Engineering Design - Proceedings of the IUTAM Symposium on Nonlinear Dynamics for Advanced Technologies and Engineering Design
EditorsGiuseppe Rega, Marian Wiercigroch
PublisherSpringer Verlag
Pages249-261
Number of pages13
ISBN (Print)9789400757417
DOIs
StatePublished - 2013
EventIUTAM Symposium on Nonlinear Dynamics for Advanced Technologies and Engineering Design, 2010 - Aberdeen, United Kingdom
Duration: Jul 27 2010Jul 30 2010

Publication series

NameIUTAM Bookseries
Volume32
ISSN (Print)1875-3507

Conference

ConferenceIUTAM Symposium on Nonlinear Dynamics for Advanced Technologies and Engineering Design, 2010
Country/TerritoryUnited Kingdom
CityAberdeen
Period07/27/1007/30/10

Bibliographical note

Publisher Copyright:
© Springer Science+Business Media Dordrecht 2013.

Keywords

  • Dynamic pull-in
  • Dynamical integrity
  • Integrity factor
  • MEMS

ASJC Scopus subject areas

  • Mechanical Engineering
  • Aerospace Engineering
  • Automotive Engineering
  • Acoustics and Ultrasonics
  • Civil and Structural Engineering

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