TY - GEN
T1 - Digital electrostatic acoustic transducer array
AU - Carreno, Armando Arpys Arevalo
AU - Castro, David
AU - Conchouso Gonzalez, David
AU - Kosel, Jürgen
AU - Foulds, Ian G.
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2016/12/19
Y1 - 2016/12/19
N2 - In this paper we present the fabrication and characterization of an array of electrostatic acoustic transducers. The array is micromachined on a silicon wafer using standard micro-machining techniques. Each array contains 2n electrostatic transducer membranes, where “n” is the bit number. Every element of the array has a hexagonal membrane shape structure, which is separated from the substrate by 3µm air gap. The membrane is made out 5µm thick polyimide layer that has a bottom gold electrode on the substrate and a gold top electrode on top of the membrane (250nm). The wafer layout design was diced in nine chips with different array configurations, with variation of the membrane dimensions. The device was tested with 90 V giving and sound output level as high as 35dB, while actuating all the elements at the same time.
AB - In this paper we present the fabrication and characterization of an array of electrostatic acoustic transducers. The array is micromachined on a silicon wafer using standard micro-machining techniques. Each array contains 2n electrostatic transducer membranes, where “n” is the bit number. Every element of the array has a hexagonal membrane shape structure, which is separated from the substrate by 3µm air gap. The membrane is made out 5µm thick polyimide layer that has a bottom gold electrode on the substrate and a gold top electrode on top of the membrane (250nm). The wafer layout design was diced in nine chips with different array configurations, with variation of the membrane dimensions. The device was tested with 90 V giving and sound output level as high as 35dB, while actuating all the elements at the same time.
UR - http://hdl.handle.net/10754/622534
UR - http://ieeexplore.ieee.org/document/7758238/
UR - http://www.scopus.com/inward/record.url?scp=85007207174&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2016.7758238
DO - 10.1109/NEMS.2016.7758238
M3 - Conference contribution
SN - 9781509019472
SP - 225
EP - 228
BT - 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
PB - Institute of Electrical and Electronics Engineers (IEEE)
ER -