TY - GEN
T1 - Dielectric properties of PMMA-SiO2 hybrid films
AU - Morales-Acosta, M. D.
AU - Quevedo-López, Manuel Angel Quevedo
AU - Alshareef, Husam N.
AU - Gnade, Bruce E.
AU - Ramírez-Bon, Rafael
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2010/3
Y1 - 2010/3
N2 - Organic-inorganic hybrid films were synthesized by a modified sol-gel process. PMMASiO2 films were prepared using methylmethacrylate (MMA), tetraethil-orthosilicate (TEOS) as silicon dioxide source, and 3-trimetoxi-silil-propil-methacrylate (TMSPM) as coupling agent. FTIR measurements were performed on the hybrid films to confirm the presence of PMMA-SiO2 bonding. In addition, metal-insulator-metal (MIM) devices were fabricated to study the dielectric constant of the films as function of frequency (1 KHz to 1 MHz). Electrical results show a weak trend of the dielectric constant of the hybrid films with MMA molar ratio. More importantly, the PMMA-SiO2 hybrid films showed a higher dielectric constant than SiO2 and PMMA layers, which is likely due to the presence of additional C-O-C bond. © (2010) Trans Tech Publications.
AB - Organic-inorganic hybrid films were synthesized by a modified sol-gel process. PMMASiO2 films were prepared using methylmethacrylate (MMA), tetraethil-orthosilicate (TEOS) as silicon dioxide source, and 3-trimetoxi-silil-propil-methacrylate (TMSPM) as coupling agent. FTIR measurements were performed on the hybrid films to confirm the presence of PMMA-SiO2 bonding. In addition, metal-insulator-metal (MIM) devices were fabricated to study the dielectric constant of the films as function of frequency (1 KHz to 1 MHz). Electrical results show a weak trend of the dielectric constant of the hybrid films with MMA molar ratio. More importantly, the PMMA-SiO2 hybrid films showed a higher dielectric constant than SiO2 and PMMA layers, which is likely due to the presence of additional C-O-C bond. © (2010) Trans Tech Publications.
UR - http://hdl.handle.net/10754/564274
UR - https://www.scientific.net/MSF.644.25
UR - http://www.scopus.com/inward/record.url?scp=77951014738&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.644.25
DO - 10.4028/www.scientific.net/MSF.644.25
M3 - Conference contribution
SN - 087849281X; 9780878492817
SP - 25
EP - 28
BT - Materials Science Forum
PB - Trans Tech Publications
ER -