Development of 〈110〉 texture in copper thin films

H. L. Wei, Hanchen Huang, C. H. Woo, R. K. Zheng, G. H. Wen, X. X. Zhang

Research output: Contribution to journalArticlepeer-review

50 Scopus citations


Apart from the scientific interest, texture development in copper thin films is of crucial importance to their applications as interconnects or corrosion resistant coating. We report here a dominant 〈110〉 texture of copper thin films - preferred for oxidation-resistant applications - deposited by direct current magnetron sputtering. Scanning electron microscopy shows that the copper films go through a transition from 〈111〉 columns to 〈110〉 hillocks as the deposition proceeds. Cross-sectional transmission electron microscopy (TEM) indicates that the 〈110〉 grains nucleate at boundaries of 〈111〉 grains. Further, we have proposed a stress-driven nucleation and growth model of 〈110〉 grains based on the x-ray diffraction characterization and the TEM observations.

Original languageEnglish (US)
Pages (from-to)2290-2292
Number of pages3
JournalApplied Physics Letters
Issue number13
StatePublished - Apr 1 2002
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)


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