TY - JOUR
T1 - Deterministic Integration of Out-of-Plane Sensor Arrays for Flexible Electronic Applications
AU - Hussain, Aftab M.
AU - Hussain, Muhammad Mustafa
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2016/7/25
Y1 - 2016/7/25
N2 - A design strategy for fully flexible electrode arrays with out-of-plane through polymer vias (TPVs) for monolithic 3D integration of sensor readout circuitry is presented. The TPVs are formed using copper embedded in thin polyimide structure for support. The copper interconnects offer a stable impedance frequency response from DC to 100 kHz (Z ≈ 20 Ω, θ ≈ 0°).
AB - A design strategy for fully flexible electrode arrays with out-of-plane through polymer vias (TPVs) for monolithic 3D integration of sensor readout circuitry is presented. The TPVs are formed using copper embedded in thin polyimide structure for support. The copper interconnects offer a stable impedance frequency response from DC to 100 kHz (Z ≈ 20 Ω, θ ≈ 0°).
UR - http://hdl.handle.net/10754/621645
UR - http://doi.wiley.com/10.1002/smll.201600952
UR - http://www.scopus.com/inward/record.url?scp=84989916546&partnerID=8YFLogxK
U2 - 10.1002/smll.201600952
DO - 10.1002/smll.201600952
M3 - Article
C2 - 27453536
SN - 1613-6810
VL - 12
SP - 5141
EP - 5145
JO - Small
JF - Small
IS - 37
ER -