Determining Out-of-Plane Hole Mobility in CuSCN via the Time-of-Flight Technique To Elucidate Its Function in Perovskite Solar Cells

Lokeshwari Mohan, Sinclair R. Ratnasingham, Julianna Panidi, Matyas Daboczi, Ji Seon Kim, Thomas D. Anthopoulos, Joe Briscoe, Martyn A. McLachlan, Theo Kreouzis

Research output: Contribution to journalArticlepeer-review

4 Scopus citations


Copper(I) thiocyanate (CuSCN) is a stable, low-cost, solution-processable p-type inorganic semiconductor used in numerous optoelectronic applications. Here, for the first time, we employ the time-of-flight (ToF) technique to measure the out-of-plane hole mobility of CuSCN films, enabled by the deposition of 4 μm-thick films using aerosol-assisted chemical vapor deposition (AACVD). A hole mobility of ∼10–3 cm2/V s was measured with a weak electric field dependence of 0.005 cm/V1/2. Additionally, by measuring several 1.5 μm CuSCN films, we show that the mobility is independent of thickness. To further validate the suitability of our AACVD-prepared 1.5 μm-thick CuSCN film in device applications, we demonstrate its incorporation as a hole transport layer (HTL) in methylammonium lead iodide (MAPbI3) perovskite solar cells (PSCs). Our AACVD films result in devices with measured power conversion efficiencies of 10.4%, which compares favorably with devices prepared using spin-coated CuSCN HTLs (12.6%), despite the AACVD HTLs being an order of magnitude thicker than their spin-coated analogues. Improved reproducibility and decreased hysteresis were observed, owing to a combination of excellent film quality, high charge-carrier mobility, and favorable interface energetics. In addition to providing a fundamental insight into charge-carrier mobility in CuSCN, our work highlights the AACVD methodology as a scalable, versatile tool suitable for film deposition for use in optoelectronic devices.
Original languageEnglish (US)
JournalACS Applied Materials & Interfaces
StatePublished - Aug 7 2021

Bibliographical note

KAUST Repository Item: Exported on 2021-08-10
Acknowledgements: The authors acknowledge EPSRC Centre for Doctoral Training in Plastic Electronic Materials EP/L016702/1 for their support. T.K. wishes to acknowledge STFC (ST/V000039/1) for financial support.

ASJC Scopus subject areas

  • General Materials Science


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