Design of low cost, scalable, and high-performance TiS2 thermoelectric materials via wet ball-milling process

Pandiyarasan Veluswamy*, Saravanan Subramanian, Muhmood ul Hassan, Cafer T. Yavuz, Ho Jin Ryu, Byung Jin Cho*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Scopus citations


Thermoelectric (TE) materials could provide an efficient means for recovering waste heat energy if a low cost, scalable, and high figure-of-merit material could be fabricated. Here, we report, for the first time, a wet ball-milling method to achieve high-performance two-dimensional (2D) semi-metallic TiS2 nanoplatelets. TiO2 is milled, annealed, and sintered with sulfur under high pressure. The addition of a small amount of sulfur (S) powder during the annealing period prevents sulfur deficiency in the sintered compact, resulting in the formation of a near-stoichiometric TiS2 composition. The formation of 2D TiS2 nanoplatelets was confirmed by X-ray diffraction, field emission scanning electron microscopy with energy-dispersive spectroscopy, and X-ray photoelectron spectroscopy. The TE properties were measured in the temperature range of 25–100 °C. Further, we obtain that the prepared TiS2 has as high figure of merit as 0.35 at 100 °C. Novel wet ball mill processing strategies for the development of high-performance 2D materials such as TiS2 make it possible to incorporate these materials for scaled-up device fabrication.

Original languageEnglish (US)
Pages (from-to)8822-8832
Number of pages11
JournalJournal of Materials Science: Materials in Electronics
Issue number11
StatePublished - Apr 2022

Bibliographical note

Publisher Copyright:
© 2021, The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


Dive into the research topics of 'Design of low cost, scalable, and high-performance TiS2 thermoelectric materials via wet ball-milling process'. Together they form a unique fingerprint.

Cite this