Defect-free Metal Deposition on Two-dimensional Materials via Inkjet Printing Technology

Two-dimensional (2D) materials have many outstanding properties that make them attractive for the fabrication of electronic devices, such as high conductivity, flexibility, and transparency. However, integrating 2D materials in commercial devices and circuits is challenging because their structure and properties can be damaged during the fabrication process. Recent studies have demonstrated that standard metal deposition techniques (like electron beam evaporation and sputtering) significantly damage the atomic structure of 2D materials. Here we show that the deposition of metal via inkjet printing technology does not produce any observable damage in the atomic structure of ultra-thin 2D materials, and that it can keep a sharp interface. These conclusions are supported by abundant data obtained via atomistic simulations, transmission electron microscopy, nano-chemical metrology, and device characterization in a probe station. Our results are important for the understanding of inkjet printing technology applied to 2D materials, and they could contribute to the better design and optimization of electronic devices and circuits.