Corporate array of micromachined dipoles on silicon wafer for 60 GHz communication systems

M. O. Sallam, E. A. Soliman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations


In this paper, an antenna array operating at 60 GHz and realized on 0.675 mm thick silicon substrate is presented. The array is constructed using four micromachined half-wavelength dipoles fed by a corporate feeding network. Isolation between the antenna array and its feeding network is achieved via a ground plane. This arrangement leads to maximizing the broadside radiation with relatively high front-to-back ratio. Simulations have been carried out using both HFSS and CST, which showed very good agreement. Results reveal that the proposed antenna array has good radiation characteristics, where the directivity, gain, and radiation efficiency are around 10.5 dBi, 9.5 dBi, and 79%, respectively. © 2013 IEEE.
Original languageEnglish (US)
Title of host publication2013 International Workshop on Antenna Technology (iWAT)
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Number of pages4
ISBN (Print)9781467328319
StatePublished - Mar 2013
Externally publishedYes

Bibliographical note

KAUST Repository Item: Exported on 2020-10-01
Acknowledged KAUST grant number(s): UK-C0015 OUK
Acknowledgements: This publication is based on work supported by award number: UK-C0015 OUK made by King Abdullah University of Science and Technology (KAUST).
This publication acknowledges KAUST support, but has no KAUST affiliated authors.


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