Abstract
A unified creep-plasticity model with damage is introduced and employed to simulate the isothermal cyclic behavior of Sn-Ag solder. The proposed damage evolution law is based on a nonlinear accumulation of damage and an interaction between applied load and creep. The stress drop amplitude and hysteresis loops are modeled over a wide range of loading conditions.
| Original language | English (US) |
|---|---|
| Title of host publication | 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 379-385 |
| Number of pages | 7 |
| ISBN (Print) | 0780345266 |
| DOIs | |
| State | Published - 1998 |
| Externally published | Yes |
| Event | 48th Electronic Components and Technology Conference, ECTC 1998 - Seattle, United States Duration: May 25 1998 → May 28 1998 |
Publication series
| Name | Proceedings - Electronic Components and Technology Conference |
|---|---|
| Volume | Part F133492 |
| ISSN (Print) | 0569-5503 |
Other
| Other | 48th Electronic Components and Technology Conference, ECTC 1998 |
|---|---|
| Country/Territory | United States |
| City | Seattle |
| Period | 05/25/98 → 05/28/98 |
Bibliographical note
Publisher Copyright:© 1998 IEEE.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering