A unified creep-plasticity model with damage is introduced and employed to simulate the isothermal cyclic behavior of Sn-Ag solder. The proposed damage evolution law is based on a nonlinear accumulation of damage and an interaction between applied load and creep. The stress drop amplitude and hysteresis loops are modeled over a wide range of loading conditions.
|Original language||English (US)|
|Title of host publication||1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998|
|Publisher||Institute of Electrical and Electronics Engineers Inc.|
|Number of pages||7|
|State||Published - 1998|
|Event||48th Electronic Components and Technology Conference, ECTC 1998 - Seattle, United States|
Duration: May 25 1998 → May 28 1998
|Name||Proceedings - Electronic Components and Technology Conference|
|Other||48th Electronic Components and Technology Conference, ECTC 1998|
|Period||05/25/98 → 05/28/98|
Bibliographical noteFunding Information:
The authors would like to acknowledge the support of Semiconductor Research Corporation in development of the constitutive and damage model for solders.
© 1998 IEEE.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering