Cleavable Ligands Enable Uniform Close Packing in Colloidal Quantum Dot Solids

Graham H. Carey, Mingjian Yuan, Riccardo Comin, Oleksandr Voznyy, Edward H. Sargent

Research output: Contribution to journalArticlepeer-review

9 Scopus citations


Uniform close packing in colloidal quantum dot solids is critical for high-optical density, high-mobility optoelectronic devices. A hybrid-ligand strategy is developed, combining the advantages of solid state and solution-phase ligand exchanges. This strategy uses a medium length thioamide ligand that is readily cleaved in a single chemical treatment, leading to quantum dot solids with uniformly packed domains 3 times larger than those observed in ligand-exchanged films.
Original languageEnglish (US)
Pages (from-to)21995-22000
Number of pages6
JournalACS Applied Materials & Interfaces
Issue number39
StatePublished - 2015
Externally publishedYes

Bibliographical note

KAUST Repository Item: Exported on 2021-11-04
Acknowledged KAUST grant number(s): KUS-11-009-21
Acknowledgements: This publication is based in part on work supported by Award KUS-11-009-21, made by King Abdullah University of Science and Technology (KAUST), by the Ontario Research Fund Research Excellence Program, and by the Natural Sciences and Engineering Research Council. G.H.C. acknowledges funding support from the Vanier Canada Graduate Scholarship program.
This publication acknowledges KAUST support, but has no KAUST affiliated authors.

ASJC Scopus subject areas

  • General Materials Science


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