TY - GEN
T1 - Characterizations and performance evaluations of thin film interdigital sensors for Gram-negative bacteria detection
AU - Mohd. Syaifudin, A. R.
AU - Mukhopadhyay, Subhas Chandra
AU - Yu, Paklam
AU - Chuang, Chenghsin
AU - Wu, Hsunpei
AU - Gooneratne, Chinthaka Pasan
AU - Kosel, Jürgen
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2011/11
Y1 - 2011/11
N2 - Thin film interdigital sensors have been designed and fabricated. The sensors were fabricated using different substrates and using different fabrication technology. The initial design was fabricated on glass slide and fabricated using IDT (Intergrated Device Technology). The new sensors were fabricated on silicon/silicon dioxide wafer. All sensors were coated with APTES, a cross-linker bind to certain bio-molecules and then were immobilized with Polymyxin B, a specific bio-molecules that bind to endotoxin (Lipopolysaccharide, LPS). Sensors were tested for different concentrations of LPS. The impedance characteristics were presented using Impedance Spectroscopy method. A principle component analysis (PCA) was used for better data classification method. © 2011 IEEE.
AB - Thin film interdigital sensors have been designed and fabricated. The sensors were fabricated using different substrates and using different fabrication technology. The initial design was fabricated on glass slide and fabricated using IDT (Intergrated Device Technology). The new sensors were fabricated on silicon/silicon dioxide wafer. All sensors were coated with APTES, a cross-linker bind to certain bio-molecules and then were immobilized with Polymyxin B, a specific bio-molecules that bind to endotoxin (Lipopolysaccharide, LPS). Sensors were tested for different concentrations of LPS. The impedance characteristics were presented using Impedance Spectroscopy method. A principle component analysis (PCA) was used for better data classification method. © 2011 IEEE.
UR - http://hdl.handle.net/10754/564457
UR - http://ieeexplore.ieee.org/document/6136959/
UR - http://www.scopus.com/inward/record.url?scp=84863243918&partnerID=8YFLogxK
U2 - 10.1109/ICSensT.2011.6136959
DO - 10.1109/ICSensT.2011.6136959
M3 - Conference contribution
SN - 9781457701672
SP - 181
EP - 186
BT - 2011 Fifth International Conference on Sensing Technology
PB - Institute of Electrical and Electronics Engineers (IEEE)
ER -