Abstract
Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.
Original language | English (US) |
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Pages (from-to) | 8707-8713 |
Number of pages | 7 |
Journal | J. Mater. Chem. C |
Volume | 5 |
Issue number | 34 |
DOIs | |
State | Published - 2017 |
Bibliographical note
KAUST Repository Item: Exported on 2020-10-01Acknowledgements: This work was supported by National Natural Science Foundation of China (51571104 and 11274145), MOST International Cooperation Funds (2014DFA91340), Program for Changjiang Scholars and Innovative Research Team in the University (Grant No. IRT1251).