Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

Xuan Zhang, Xiujun Zheng, Hong Zhang, Junli Zhang, Jiecai Fu, Qiang Zhang, Chaoyi Peng, Feiming Bai, Xixiang Zhang, Yong Peng

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.
Original languageEnglish (US)
Pages (from-to)8707-8713
Number of pages7
JournalJ. Mater. Chem. C
Volume5
Issue number34
DOIs
StatePublished - 2017

Bibliographical note

KAUST Repository Item: Exported on 2020-10-01
Acknowledgements: This work was supported by National Natural Science Foundation of China (51571104 and 11274145), MOST International Cooperation Funds (2014DFA91340), Program for Changjiang Scholars and Innovative Research Team in the University (Grant No. IRT1251).

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