TY - JOUR
T1 - Benchmarking Silicon FinFET With the Carbon Nanotube and 2D-FETs for Advanced Node CMOS Logic Application
AU - Das, Uttam Kumar
AU - Hussain, Muhammad Mustafa
N1 - KAUST Repository Item: Exported on 2021-06-05
PY - 2021
Y1 - 2021
N2 - In this article, the performance of silicon FinFET is compared with carbon nanotube (CNT-FET) and 2-D field-effect transistors (2D-FETs) for the upcoming node CMOS logic application. Based on the experimental results, a 17-stage ring oscillator (RO) circuit is implemented using the compact models to analyze the stage-delay and energy-delay performances. A tightly positioned 20- and 10-nm channel-length-based CNT-FET enhances Ion and also increases the leakage currents significantly. Due to poor electrostatic control and increased gate leakage, the CNT-FET and 2D-FET provide lowered Ion and a limited ac performance. Thus, targeting an off-state current, the FinFET delivers more than three times higher drive current, as well as five times better energy-delay performances in comparison to the CNT-FET and 2D-FET. On the other hand, scaled organic FETs are yet far away to compare with FinFET technology. Hence, the silicon-based (3-D) FETs are leading in all the devices (2-D, 1-D, and 0-D) for scaling next-generation CMOS technology.
AB - In this article, the performance of silicon FinFET is compared with carbon nanotube (CNT-FET) and 2-D field-effect transistors (2D-FETs) for the upcoming node CMOS logic application. Based on the experimental results, a 17-stage ring oscillator (RO) circuit is implemented using the compact models to analyze the stage-delay and energy-delay performances. A tightly positioned 20- and 10-nm channel-length-based CNT-FET enhances Ion and also increases the leakage currents significantly. Due to poor electrostatic control and increased gate leakage, the CNT-FET and 2D-FET provide lowered Ion and a limited ac performance. Thus, targeting an off-state current, the FinFET delivers more than three times higher drive current, as well as five times better energy-delay performances in comparison to the CNT-FET and 2D-FET. On the other hand, scaled organic FETs are yet far away to compare with FinFET technology. Hence, the silicon-based (3-D) FETs are leading in all the devices (2-D, 1-D, and 0-D) for scaling next-generation CMOS technology.
UR - http://hdl.handle.net/10754/669357
UR - https://ieeexplore.ieee.org/document/9445221/
U2 - 10.1109/TED.2021.3081076
DO - 10.1109/TED.2021.3081076
M3 - Article
SN - 1557-9646
SP - 1
EP - 6
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
ER -