All inkjet printed 3D microwave capacitors and inductors with vias

Garret McKerricher, Juan Carlos Cano González, Atif Shamim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

28 Scopus citations


For the first time we present a method to create all inkjet printed multilayer RF passive components including vias. Although there has been previous work on multilayer RF components, they are not fully inkjet printed and involve complicated processing techniques such as laser cutting, conductive epoxy, or reactive ion etching This work demonstrates a truly all inkjet printed solution with a novel dissolving method for vias realization. A major issue with inkjet printing is often surface roughness, however by processing these materials at low temperature surface roughness
Original languageEnglish (US)
Title of host publication2013 IEEE MTT-S International Microwave Symposium Digest (MTT)
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
ISBN (Print)9781467361767
StatePublished - Jun 2013

Bibliographical note

KAUST Repository Item: Exported on 2020-10-01


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