Accurate modeling of substrate coupling for substrates without grounded backplates

Q. Su; Y. Massoud; J. Kawa; C. Chiang

doi:10.1109/SOC.2003.1241521

Accurate modeling of substrate coupling for substrates without grounded backplates

Q. Su, Y. Massoud, J. Kawa, C. Chiang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

11 Scopus citations

Abstract

An accurate and numerically stable formulation is presented for the substrate resistive coupling using boundary element methods, for floating substrates (without grounded backplates).

Original language	English (US)
Title of host publication	Proceedings - IEEE International SOC Conference, SOCC 2003
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	281-282
Number of pages	2
ISBN (Print)	0780381823
DOIs	https://doi.org/10.1109/SOC.2003.1241521
State	Published - Jan 1 2003
Externally published	Yes

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Generated from Scopus record by KAUST IRTS on 2022-09-13

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10.1109/SOC.2003.1241521

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title = "Accurate modeling of substrate coupling for substrates without grounded backplates",

abstract = "An accurate and numerically stable formulation is presented for the substrate resistive coupling using boundary element methods, for floating substrates (without grounded backplates).",

author = "Q. Su and Y. Massoud and J. Kawa and C. Chiang",

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year = "2003",

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doi = "10.1109/SOC.2003.1241521",

language = "English (US)",

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T1 - Accurate modeling of substrate coupling for substrates without grounded backplates

AU - Su, Q.

AU - Massoud, Y.

AU - Kawa, J.

AU - Chiang, C.

N1 - Generated from Scopus record by KAUST IRTS on 2022-09-13

PY - 2003/1/1

Y1 - 2003/1/1

N2 - An accurate and numerically stable formulation is presented for the substrate resistive coupling using boundary element methods, for floating substrates (without grounded backplates).

AB - An accurate and numerically stable formulation is presented for the substrate resistive coupling using boundary element methods, for floating substrates (without grounded backplates).

UR - http://ieeexplore.ieee.org/document/1241521/

UR - http://www.scopus.com/inward/record.url?scp=79956143885&partnerID=8YFLogxK

U2 - 10.1109/SOC.2003.1241521

DO - 10.1109/SOC.2003.1241521

M3 - Conference contribution

SN - 0780381823

SP - 281

EP - 282

BT - Proceedings - IEEE International SOC Conference, SOCC 2003

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Accurate modeling of substrate coupling for substrates without grounded backplates

Abstract

Bibliographical note

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