TY - GEN
T1 - A Via-Less Fully Screen-Printed Reconfigurable Intelligent Surface for 5G Millimeter Wave Communication
AU - Yang, Yiming
AU - Wang, Ruiqi
AU - Vaseem, Mohammad
AU - Makki, Behrooz
AU - Shamim, Atif
N1 - KAUST Repository Item: Exported on 2023-10-05
PY - 2023/7/23
Y1 - 2023/7/23
N2 - In this paper, we propose a via-less fully screen-printed reconfigurable intelligent surface which can establish a second line-of-sight communication from 23.5GHz to 29.5GHz. By serially connecting the H shaped resonator along the H field of the incident wave, we minimize the effect of the biasing lines and make a via-less design, which reduces the fabrication difficulty and cost. The unit-cell simulation of the array with screen-printed VO2 switches shows a 215° to 160° phase shift difference between the ON and OFF states within bandwidth. During the field testing of the ideal arrays, we verify that the array can redirect the 45° incident wave to 0° reflection with a signal enhancement of at least 10 dB as compared to the array which has all unit cells in the OFF condition.
AB - In this paper, we propose a via-less fully screen-printed reconfigurable intelligent surface which can establish a second line-of-sight communication from 23.5GHz to 29.5GHz. By serially connecting the H shaped resonator along the H field of the incident wave, we minimize the effect of the biasing lines and make a via-less design, which reduces the fabrication difficulty and cost. The unit-cell simulation of the array with screen-printed VO2 switches shows a 215° to 160° phase shift difference between the ON and OFF states within bandwidth. During the field testing of the ideal arrays, we verify that the array can redirect the 45° incident wave to 0° reflection with a signal enhancement of at least 10 dB as compared to the array which has all unit cells in the OFF condition.
UR - http://hdl.handle.net/10754/687737
UR - https://ieeexplore.ieee.org/document/10237622/
UR - http://www.scopus.com/inward/record.url?scp=85172418432&partnerID=8YFLogxK
U2 - 10.1109/USNC-URSI52151.2023.10237622
DO - 10.1109/USNC-URSI52151.2023.10237622
M3 - Conference contribution
SN - 9781665442282
SP - 215
EP - 216
BT - 2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI)
PB - IEEE
ER -