A versatile multi-user polyimide surface micromachinning process for MEMS applications

Armando Arpys Arevalo Carreno; E. Byas; David Conchouso Gonzalez; David Castro; Saad Ilyas; Ian G. Foulds

doi:10.1109/NEMS.2015.7147492

A versatile multi-user polyimide surface micromachinning process for MEMS applications

Armando Arpys Arevalo Carreno, E. Byas, David Conchouso Gonzalez, David Castro, Saad Ilyas, Ian G. Foulds

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

35 Scopus citations

Abstract

This paper reports a versatile multi-user micro-fabrication process for MEMS devices, the 'Polyimide MEMS Multi-User Process' (PiMMPs). The reported process uses polyimide as the structural material and three separate metallization layers that can be interconnected depending on the desired application. This process enables for the first time the development of out-of-plane compliant mechanisms that can be designed using six different physical principles for actuation and sensing on a wafer from a single fabrication run. These principles are electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing, thermocouple-based sensing and radio frequency transmission and reception. © 2015 IEEE.

Original language	English (US)
Title of host publication	10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	561-565
Number of pages	5
ISBN (Print)	9781467366953
DOIs	https://doi.org/10.1109/NEMS.2015.7147492
State	Published - Apr 2015

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KAUST Repository Item: Exported on 2020-10-01

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Carreno, A. A. A., Byas, E., Conchouso Gonzalez, D., Castro, D., Ilyas, S., & Foulds, I. G. (2015). A versatile multi-user polyimide surface micromachinning process for MEMS applications. In 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (pp. 561-565). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/NEMS.2015.7147492

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title = "A versatile multi-user polyimide surface micromachinning process for MEMS applications",

abstract = "This paper reports a versatile multi-user micro-fabrication process for MEMS devices, the 'Polyimide MEMS Multi-User Process' (PiMMPs). The reported process uses polyimide as the structural material and three separate metallization layers that can be interconnected depending on the desired application. This process enables for the first time the development of out-of-plane compliant mechanisms that can be designed using six different physical principles for actuation and sensing on a wafer from a single fabrication run. These principles are electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing, thermocouple-based sensing and radio frequency transmission and reception. {\textcopyright} 2015 IEEE.",

author = "Carreno, {Armando Arpys Arevalo} and E. Byas and {Conchouso Gonzalez}, David and David Castro and Saad Ilyas and Foulds, {Ian G.}",

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year = "2015",

month = apr,

doi = "10.1109/NEMS.2015.7147492",

language = "English (US)",

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Carreno, AAA, Byas, E, Conchouso Gonzalez, D, Castro, D, Ilyas, S & Foulds, IG 2015, A versatile multi-user polyimide surface micromachinning process for MEMS applications. in 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Institute of Electrical and Electronics Engineers (IEEE), pp. 561-565. https://doi.org/10.1109/NEMS.2015.7147492

A versatile multi-user polyimide surface micromachinning process for MEMS applications. / Carreno, Armando Arpys Arevalo; Byas, E.; Conchouso Gonzalez, David et al.
10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Institute of Electrical and Electronics Engineers (IEEE), 2015. p. 561-565.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - A versatile multi-user polyimide surface micromachinning process for MEMS applications

AU - Carreno, Armando Arpys Arevalo

AU - Byas, E.

AU - Conchouso Gonzalez, David

AU - Castro, David

AU - Ilyas, Saad

AU - Foulds, Ian G.

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PY - 2015/4

Y1 - 2015/4

N2 - This paper reports a versatile multi-user micro-fabrication process for MEMS devices, the 'Polyimide MEMS Multi-User Process' (PiMMPs). The reported process uses polyimide as the structural material and three separate metallization layers that can be interconnected depending on the desired application. This process enables for the first time the development of out-of-plane compliant mechanisms that can be designed using six different physical principles for actuation and sensing on a wafer from a single fabrication run. These principles are electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing, thermocouple-based sensing and radio frequency transmission and reception. © 2015 IEEE.

AB - This paper reports a versatile multi-user micro-fabrication process for MEMS devices, the 'Polyimide MEMS Multi-User Process' (PiMMPs). The reported process uses polyimide as the structural material and three separate metallization layers that can be interconnected depending on the desired application. This process enables for the first time the development of out-of-plane compliant mechanisms that can be designed using six different physical principles for actuation and sensing on a wafer from a single fabrication run. These principles are electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing, thermocouple-based sensing and radio frequency transmission and reception. © 2015 IEEE.

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U2 - 10.1109/NEMS.2015.7147492

DO - 10.1109/NEMS.2015.7147492

M3 - Conference contribution

SN - 9781467366953

SP - 561

EP - 565

BT - 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

PB - Institute of Electrical and Electronics Engineers (IEEE)

ER -

A versatile multi-user polyimide surface micromachinning process for MEMS applications

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