A study of interface and adhesion of c-BN film on Si(1 0 0) modified by nitrogen plasma based ion implantation technique

Jingze Tian*, Qing Zhang, Lifang Xia, S. F. Yoon, J. Ahn, E. S. Byon, Q. Zhou, S. G. Wang, Jingqi Li, D. J. Yang

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    5 Scopus citations

    Abstract

    Cubic boron nitride (c-BN) films were deposited on Si substrate with poor adhesion using magnetically enhanced active reaction evaporation (ME-ARE). An attempt has been made to enhance the adhesion strength between c-BN film and substrate by nitrogen plasma based ion implantation (PBII) into c-BN film. Nitrogen ion doses range from 5 × 1016 to 1 × 10 17ionscm-2 at an implant voltage of 50kV. The nitrogen ion implanted c-BN films were analyzed using FTIR, scratch test, and XPS to investigate the change of structure, adhesion strength of c-BN film, and interfacial mixing between the initial turbostratic BN (t-BN) film layer and substrate caused by nitrogen ion implantation. FTIR spectra showed little change of c-BN phase content in the films under the above implantation conditions but XPS depth elemental profile of N+-implanted boron nitride films displayed a mixed layer consisting of elements from film and substrate formed at interface. A highly optimized dynamic Monte Carlo program TAMIX was used to simulate the PBII process in a good agreement with above measured depth elemental profile. The scratch test showed that the adhesion strength evaluated in terms of the critical load of N+-implanted c-BN film was 1.4 times higher than that of as deposited c-BM film.

    Original languageEnglish (US)
    Pages (from-to)917-922
    Number of pages6
    JournalMaterials Research Bulletin
    Volume39
    Issue number7-8
    DOIs
    StatePublished - Jun 8 2004

    Keywords

    • A. Nitrides
    • A. Thin films
    • B. Plasma deposition
    • C. Infrared spectroscopy

    ASJC Scopus subject areas

    • General Materials Science
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering

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