In the high-speed signal path on PCB and packagings, vias usually causes most discontinuities and thereby crosstalks. In simulation and characterizations, they also generate more errors than the trace parts due to rich modes around them. To achieve both efficiency and accuracy, in this paper, a new domain decomposition based finite element time domain (FETD) method is proposed for the analysis of power/ground plate pairs with various types of antipads. Using the magnetic field feature, the 3D computational domain is firstly represented by a quasi-2D field. Then by taking advantage of the fast decaying property of high order modes, the quasi-2D FETD is further simplified to a hybrid 2D/quasi-2D algorithm. Assisted by the wave-port excitation and its S-parameter extraction technique, irregularly shaped antipads of complex via patterns are benchmarked to demonstrate the accuracy and efficiency of the proposed algorithm.
|Original language||English (US)|
|Title of host publication||2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)|
|Publisher||Institute of Electrical and Electronics Engineers (IEEE)|
|Number of pages||3|
|State||Published - Nov 16 2018|