A New Efficient Domain Decomposition Method for Highly Irregular Via Patterns

Ping Li; Lijun Jiang; Xiaoyan Xiong; Hakan Bagci

doi:10.1109/epeps.2018.8534309

A New Efficient Domain Decomposition Method for Highly Irregular Via Patterns

Ping Li, Lijun Jiang, Xiaoyan Xiong, Hakan Bagci

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

In the high-speed signal path on PCB and packagings, vias usually causes most discontinuities and thereby crosstalks. In simulation and characterizations, they also generate more errors than the trace parts due to rich modes around them. To achieve both efficiency and accuracy, in this paper, a new domain decomposition based finite element time domain (FETD) method is proposed for the analysis of power/ground plate pairs with various types of antipads. Using the magnetic field feature, the 3D computational domain is firstly represented by a quasi-2D field. Then by taking advantage of the fast decaying property of high order modes, the quasi-2D FETD is further simplified to a hybrid 2D/quasi-2D algorithm. Assisted by the wave-port excitation and its S-parameter extraction technique, irregularly shaped antipads of complex via patterns are benchmarked to demonstrate the accuracy and efficiency of the proposed algorithm.

Original language	English (US)
Title of host publication	2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	189-191
Number of pages	3
ISBN (Print)	9781538693032
DOIs	https://doi.org/10.1109/epeps.2018.8534309
State	Published - Nov 16 2018

Bibliographical note

KAUST Repository Item: Exported on 2020-10-01
Acknowledgements: This work was supported in part by the Research Grants Council of Hong Kong (GRF 17207114 and GRF 17210815), AOARD FA2386-17-1-0010, NSFC 61271158, and Hong Kong UGC AoE/P-04/08.

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10.1109/epeps.2018.8534309

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title = "A New Efficient Domain Decomposition Method for Highly Irregular Via Patterns",

abstract = "In the high-speed signal path on PCB and packagings, vias usually causes most discontinuities and thereby crosstalks. In simulation and characterizations, they also generate more errors than the trace parts due to rich modes around them. To achieve both efficiency and accuracy, in this paper, a new domain decomposition based finite element time domain (FETD) method is proposed for the analysis of power/ground plate pairs with various types of antipads. Using the magnetic field feature, the 3D computational domain is firstly represented by a quasi-2D field. Then by taking advantage of the fast decaying property of high order modes, the quasi-2D FETD is further simplified to a hybrid 2D/quasi-2D algorithm. Assisted by the wave-port excitation and its S-parameter extraction technique, irregularly shaped antipads of complex via patterns are benchmarked to demonstrate the accuracy and efficiency of the proposed algorithm.",

author = "Ping Li and Lijun Jiang and Xiaoyan Xiong and Hakan Bagci",

note = "KAUST Repository Item: Exported on 2020-10-01 Acknowledgements: This work was supported in part by the Research Grants Council of Hong Kong (GRF 17207114 and GRF 17210815), AOARD FA2386-17-1-0010, NSFC 61271158, and Hong Kong UGC AoE/P-04/08.",

year = "2018",

month = nov,

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doi = "10.1109/epeps.2018.8534309",

language = "English (US)",

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booktitle = "2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)",

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A New Efficient Domain Decomposition Method for Highly Irregular Via Patterns. / Li, Ping; Jiang, Lijun; Xiong, Xiaoyan et al.
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). Institute of Electrical and Electronics Engineers (IEEE), 2018. p. 189-191.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - A New Efficient Domain Decomposition Method for Highly Irregular Via Patterns

AU - Li, Ping

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AU - Xiong, Xiaoyan

AU - Bagci, Hakan

N1 - KAUST Repository Item: Exported on 2020-10-01 Acknowledgements: This work was supported in part by the Research Grants Council of Hong Kong (GRF 17207114 and GRF 17210815), AOARD FA2386-17-1-0010, NSFC 61271158, and Hong Kong UGC AoE/P-04/08.

PY - 2018/11/16

Y1 - 2018/11/16

N2 - In the high-speed signal path on PCB and packagings, vias usually causes most discontinuities and thereby crosstalks. In simulation and characterizations, they also generate more errors than the trace parts due to rich modes around them. To achieve both efficiency and accuracy, in this paper, a new domain decomposition based finite element time domain (FETD) method is proposed for the analysis of power/ground plate pairs with various types of antipads. Using the magnetic field feature, the 3D computational domain is firstly represented by a quasi-2D field. Then by taking advantage of the fast decaying property of high order modes, the quasi-2D FETD is further simplified to a hybrid 2D/quasi-2D algorithm. Assisted by the wave-port excitation and its S-parameter extraction technique, irregularly shaped antipads of complex via patterns are benchmarked to demonstrate the accuracy and efficiency of the proposed algorithm.

AB - In the high-speed signal path on PCB and packagings, vias usually causes most discontinuities and thereby crosstalks. In simulation and characterizations, they also generate more errors than the trace parts due to rich modes around them. To achieve both efficiency and accuracy, in this paper, a new domain decomposition based finite element time domain (FETD) method is proposed for the analysis of power/ground plate pairs with various types of antipads. Using the magnetic field feature, the 3D computational domain is firstly represented by a quasi-2D field. Then by taking advantage of the fast decaying property of high order modes, the quasi-2D FETD is further simplified to a hybrid 2D/quasi-2D algorithm. Assisted by the wave-port excitation and its S-parameter extraction technique, irregularly shaped antipads of complex via patterns are benchmarked to demonstrate the accuracy and efficiency of the proposed algorithm.

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U2 - 10.1109/epeps.2018.8534309

DO - 10.1109/epeps.2018.8534309

M3 - Conference contribution

SN - 9781538693032

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BT - 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

PB - Institute of Electrical and Electronics Engineers (IEEE)

ER -

A New Efficient Domain Decomposition Method for Highly Irregular Via Patterns

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