TY - JOUR
T1 - A Molecular-Scale Understanding of Cohesion and Fracture in P3HT:Fullerene Blends
AU - Tummala, Naga Rajesh
AU - Bruner, Christopher
AU - Risko, Chad
AU - Bredas, Jean-Luc
AU - Dauskardt, Reinhold H.
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2015/4/30
Y1 - 2015/4/30
N2 - Quantifying cohesion and understanding fracture phenomena in thin-film electronic devices are necessary for improved materials design and processing criteria. For organic photovoltaics (OPVs), the cohesion of the photoactive layer portends its mechanical flexibility, reliability, and lifetime. Here, the molecular mechanism for the initiation of cohesive failure in bulk heterojunction (BHJ) OPV active layers derived from the semiconducting polymer poly-(3-hexylthiophene) [P3HT] and two mono-substituted fullerenes is examined experimentally and through molecular-dynamics simulations. The results detail how, under identical conditions, cohesion significantly changes due to minor variations in the fullerene adduct functionality, an important materials consideration that needs to be taken into account across fields where soluble fullerene derivatives are used.
AB - Quantifying cohesion and understanding fracture phenomena in thin-film electronic devices are necessary for improved materials design and processing criteria. For organic photovoltaics (OPVs), the cohesion of the photoactive layer portends its mechanical flexibility, reliability, and lifetime. Here, the molecular mechanism for the initiation of cohesive failure in bulk heterojunction (BHJ) OPV active layers derived from the semiconducting polymer poly-(3-hexylthiophene) [P3HT] and two mono-substituted fullerenes is examined experimentally and through molecular-dynamics simulations. The results detail how, under identical conditions, cohesion significantly changes due to minor variations in the fullerene adduct functionality, an important materials consideration that needs to be taken into account across fields where soluble fullerene derivatives are used.
UR - http://hdl.handle.net/10754/550712
UR - http://pubs.acs.org/doi/abs/10.1021/acsami.5b02202
UR - http://www.scopus.com/inward/record.url?scp=84929191042&partnerID=8YFLogxK
U2 - 10.1021/acsami.5b02202
DO - 10.1021/acsami.5b02202
M3 - Article
SN - 1944-8244
VL - 7
SP - 9957
EP - 9964
JO - ACS Applied Materials & Interfaces
JF - ACS Applied Materials & Interfaces
IS - 18
ER -