Abstract
This paper presents two dimensional (2D) RRAM devices exploiting multilayer hexagonal boron nitride (h-BN) as active switching layer. Different electrodes including Cu, Ni-doped Cu (CuNi) and graphene (G) are considered. The devices show low set/reset voltages, high on/off current ratio, good endurance and very low overall variability. Experimental results are interpreted using a novel simulation framework, which proves that the memory behavior is enabled by the manipulation of a boron (B)-deficient conductive filament (CF). The cyclical release and diffusion of B ions are the key physical mechanisms responsible for switching.
Original language | English (US) |
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Title of host publication | Technical Digest - International Electron Devices Meeting, IEDM |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 34.8.1-34.8.4 |
Number of pages | 1 |
ISBN (Print) | 9781509039012 |
DOIs | |
State | Published - Jan 31 2017 |
Externally published | Yes |