Calculated based on number of publications stored in Pure and citations from Scopus
1998 …2024

Research activity per year

Network

Mohamed-Slim Alouini

Person: Faculty

Nasir Alfaraj

Person: Post-Doctoral

Iman Roqan

Person: Faculty

Udo Schwingenschloegl

Person: Faculty

Hakan Bagci

Person: Faculty

Mohamed Eddaoudi

Person: Faculty

Jianxin Wang

Person: Research Scientist

Osama Shekhah

Person: Research Scientist

Mustapha Ouhssain

Person: Research Scientist

Partha Maity

Person: Research Scientist

Randi Azmi

Person: Post-Doctoral

Xin Zhu

Person: Post-Doctoral

Simil Thomas

Person: Research Scientist

Hendrik Faber

Person: Research Scientist

Michael Berumen

Person: Faculty

Stefaan De Wolf

Person: Faculty

Vijay Kumar Maka

Person: Post-Doctoral

Mohamad Nugraha

Person: Research Scientist

Kuo-Wei Huang

Person: Faculty

Ahmed Y. Alyamani

  • King Abdulaziz City for Science and Technology

External person

S. F. Yoon

  • Nanyang Technological University
  • Singapore-MIT Alliance
  • Microelectronics Centre
  • Microelectronics Center
  • Sch. of Elec. and Electron. Eng.
  • School of Electrical and Electronics Engineering
  • School of Electrical and Electronic Engineering
  • Clean Room and Characterization Lab.
  • Characterisation Laboratory
  • School of Electrical and Electronic Engineering (Block SI)
  • School of Electrical and Electronic Engineering (Block S1)
  • School of Electrical and Electronic Engineering
  • Sch. of Elec./Electron. Engineering
  • Microelectronic Center
  • Singapore-Massachusetts Inst. T.A.

External person

W. K. Loke

  • Nanyang Technological University
  • Microelectronics Center
  • School of Electrical and Electronics Engineering
  • Sch. of Elec. and Electron. Eng.
  • School of Electrical and Electronic Engineering
  • Characterisation Laboratory
  • School of Electrical and Electronic Engineering (Block S1)
  • School of Electrical and Electronic Engineering
  • Sch. of Elec./Electron. Engineering
  • Singapore-Massachusetts Inst. T.A.

External person

Munir M. El-Desouki

  • King Abdulaziz City for Science and Technology

External person

Fan Weijun

  • Nanyang Technological University
  • Microelectronics Center
  • Sch. of Elec./Electron. Engineering
  • School of Electrical and Electronic Engineering
  • Sch. of Elec. and Electron. Eng.

External person

S. Z. Wang

  • Nanyang Technological University
  • Microelectronics Center
  • Sch. of Elec./Electron. Engineering
  • School of Electrical and Electronic Engineering
  • Massachusetts Institute of Technology
  • Sch. of Elec. and Electron. Eng.

External person

Abdulrahman M. Albadri

  • King Abdulaziz City for Science and Technology

External person

Steven P. DenBaars

  • University of California at Santa Barbara

External person

Changmin Lee

  • University of California at Santa Barbara
  • University of California

External person

Shuji Nakamura

  • University of California at Santa Barbara

External person

Pallab K. Bhattacharya

  • University of Michigan, Ann Arbor

External person

James S. Speck

  • University of California at Santa Barbara

External person

Jung Wook Min

  • King Abdullah University of Science and Technology
  • University of Michigan, Ann Arbor
  • Kumoh National Institute of Technology

External person

Mohamed Ebaid

  • King Abdullah University of Science and Technology

External person

Frode Hveding

  • Saudi Aramco

External person

S. Wicaksono

  • School of Electrical and Electronics Engineering
  • Nanyang Technological University
  • Sch. of Elec. and Electron. Eng.
  • School of Electrical and Electronic Engineering
  • Characterisation Laboratory
  • School of Electrical and Electronic Engineering
  • Sch. of Elec./Electron. Engineering

External person

K. H. Tan

  • Nanyang Technological University
  • School of Electrical and Electronics Engineering
  • Sch. of Elec. and Electron. Eng.
  • School of Electrical and Electronic Engineering
  • Sch. of Elec./Electron. Engineering

External person

Biwei Wang

  • Hong Kong Polytechnic University
  • King Abdullah University of Science and Technology

External person

Jung-Hong Min

  • King Abdullah University of Science and Technology
  • Korea Photonics Technology Institute

External person

Md. Hosne Mobarok Shamim

  • King Fahd University of Petroleum and Minerals

External person

K. L. Lew

  • Nanyang Technological University
  • Sch. of Elec. and Electron. Eng.
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronics Engineering
  • Sch. of Elec./Electron. Engineering

External person

Adrian Emil Kiss

  • National Institute for Optoelectronics, 409 Atomistilor St., 077125 Magurele, Romania
  • National Institute of Research and Development for Optoelectronics INOE 2000

External person

Nicolae Catalin Zoita

  • National Institute for Optoelectronics, 409 Atomistilor St., 077125 Magurele, Romania
  • National Institute of Research and Development for Optoelectronics INOE 2000

External person

Adel Najar

  • United Arab Emirates University

External person

Fatimah Alhawaj

  • King Abdullah University of Science and Technology

External person

Yang Weng

  • National Taiwan University
  • The University of Tokyo

External person

Abdulmoneim Al-Shawaf

  • Deputy-Ministry for Environment, Ministry of Environment, Water and Agriculture, Riyadh, Saudi Arabia
  • Ministry of Environment

External person

Haiding Sun

  • University of Science and Technology of China

External person

Muhammad Arsalan

  • Carleton University

External person

Mohammad Khaled Shakfa

  • Department of Physics and Material Sciences Center, Philipps-University of Marburg, Renthof 5; 35032 Marburg Germany

External person

Sani Mukhtar

  • King Fahd University of Petroleum and Minerals

External person

E. A. Fitzgerald

  • Massachusetts Institute of Technology
  • Singapore-MIT Alliance
  • Massachusetts Inst. of Technology
  • United States Department of Energy
  • Department of Material Science and Engineering
  • Department of Materials Science and Engineering
  • Massachusetts Institute of Technology

External person

Juan M. Marin

  • King Abdullah University of Science and Technology

External person

Nan Chi

  • Fudan University

External person

R. Liu

  • National University of Singapore
  • Department of Physics
  • Department of Physics
  • Department of Physics

External person

Ahmed Ben Slimane

  • King Abdullah University of Science and Technology

External person

James S. Speck

  • University of California at Santa Barbara
  • Materials Department
  • Materials Department
  • Exploratory Research for Advanced Technology
  • University of California

External person

A. Stöhr

  • University of Duisburg-Essen
  • Zentrum für Halbleitertechnik und Optoelektronik (ZHO)
  • Zentrum für Halbleitertechnik und Optoelektronik

External person

Andrew T.S. Wee

  • National University of Singapore
  • Department of Physics
  • NUS Graduate School for Integrative Science and Engineering
  • Department of Physics
  • Department of Physics
  • Georgia Institute of Technology
  • Agency for Science, Technology and Research, Singapore
  • Inst of Materials Research and
  • Department of Physics

External person

Shuji Nakamura

  • University of California at Santa Barbara
  • Materials Department
  • Materials Department
  • Exploratory Research for Advanced Technology
  • Department of Electrical and Computer Engineering
  • University of California

External person

Pallab Bhattacharya

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science

External person

S. Fedderwitz

  • University of Duisburg-Essen
  • Zentrum für Halbleitertechnik und Optoelektronik (ZHO)
  • Zentrum für Halbleitertechnik und Optoelektronik

External person

Mohamed Shemis

  • King Fahd University of Petroleum and Minerals

External person

D. Decoster

  • Universite des Sciences et Technologies de Lille
  • Institute of Electronics, Microelectronics and Nanotechnology IEMN
  • Université de Lille

External person

C. Dohrman

  • Massachusetts Institute of Technology
  • Department of Material Science and Engineering
  • Massachusetts Institute of Technology

External person

Tae-Jin Park

  • HME Healthcare Co., Ltd., Suwon-si, Gyeonggi-do, Republic of Korea
  • King Abdullah University of Science and Technology
  • Korea Institute of Energy Research

External person

Fangchen Hu

  • Fudan University

External person

M.Z.M. Khan

  • King Fahd University of Petroleum and Minerals

External person

Yousef Al-Fehaid

  • Deputy-Ministry for Environment, Ministry of Environment, Water and Agriculture, Riyadh, Saudi Arabia
  • Ministry of Environment

External person

Steven P. DenBaars

  • University of California at Santa Barbara
  • Materials Department
  • Exploratory Research for Advanced Technology
  • Materials Department
  • Department of Electrical and Computer Engineering
  • University of California

External person

Z. Z. Sun

  • Nanyang Technological University
  • Microelectronics Center
  • School of Electrical and Electronic Engineering
  • Sch. of Elec. and Electron. Eng.
  • University of Surrey
  • The Chinese University of Hong Kong, Shenzhen
  • University of Science and Technology of China

External person

K. P. Chen

  • Nanyang Technological University
  • Singapore-MIT Alliance
  • School of Electrical and Electronics Engineering
  • School of Electrical and Electronic Engineering
  • Sch. of Elec./Electron. Engineering
  • Sch. of Elec. and Electron. Eng.

External person

K. C. Yew

  • Nanyang Technological University
  • Microelectronics Center
  • School of Electrical and Electronic Engineering
  • Sch. of Elec. and Electron. Eng.

External person

Peng Zou

  • Tongji University

External person

N. Saadsaoud

  • Universite des Sciences et Technologies de Lille
  • Institute of Electronics, Microelectronics and Nanotechnology IEMN
  • Université de Lille

External person

Pallab Bhattacharya

  • University of Michigan, Ann Arbor

External person

H. Tanoto

  • Nanyang Technological University
  • School of Electrical and Electronics Engineering
  • School of Electrical and Electronic Engineering
  • Sch. of Elec. and Electron. Eng.

External person

Dong Liang

  • Huawei Technologies Co., Ltd., Shenzhen 518129, China
  • Huawei Technologies Co., Ltd.

External person

Junping Zhang

  • Huawei Technologies Co., Ltd., Shenzhen 518129, China
  • Huawei Technologies Co., Ltd.

External person

D. Jäger

  • University of Duisburg-Essen
  • Zentrum für Halbleitertechnik und Optoelektronik (ZHO)
  • Zentrum für Halbleitertechnik und Optoelektronik

External person

Zyad O. F. Mohammed

  • King Abdullah University of Science and Technology

External person

Huai-Yung Wang

  • National Taiwan University

External person

Michele Conroy

  • University College Cork
  • Pacific Northwest National Laboratory
  • Pacific Northwest National Laboratory

External person

Zhenqiang Ma

  • University of Wisconsin-Madison

External person

Z. Xu

  • Nanyang Technological University
  • School of Electrical and Electronics Engineering
  • School of Electrical and Electronic Engineering
  • Sch. of Elec. and Electron. Eng.
  • Shandong Best Environmental Technology Co. Ltd.
  • Beijing University of Chemical Technology

External person

Gong-Ru Lin

  • National Taiwan University

External person

M. Weiß

  • University of Duisburg-Essen
  • Zentrum für Halbleitertechnik und Optoelektronik (ZHO)
  • Zentrum für Halbleitertechnik und Optoelektronik

External person

Jie Zhou

  • Electrical & Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin, UNITED STATES.

External person

Chi-Sen Lee

  • University of Michigan, Ann Arbor

External person

Wei Guo

  • University of Michigan, Ann Arbor
  • Chinese Academy of Sciences
  • Zhejiang Key Laboratory for Advanced Microelectronic Intelligent Systems and Applications

External person

W. K. Cheah

  • Nanyang Technological University
  • Microelectronics Center
  • School of Electrical and Electronic Engineering
  • Sch. of Elec. and Electron. Eng.

External person

A. Poloczek

  • University of Duisburg-Essen
  • Zentrum für Halbleitertechnik und Optoelektronik (ZHO)
  • Zentrum für Halbleitertechnik und Optoelektronik

External person

Cheng-Ting Tsai

  • National Taiwan University

External person

H. Q. Zheng

  • Nanyang Technological University
  • Sch. of Elec. and Electron. Eng.
  • School of Electrical and Electronic Engineering (Block SI)
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering (Block S1)
  • Toyo University

External person

Chen Huang

  • School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, China

External person

Ahmed Alyamani

  • King Abdulaziz City for Science and Technology

External person

Shafat Jahangir

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science

External person

Yazeed Alaskar

  • King Abdulaziz City for Science and Technology

External person

John T. Leonard

  • University of California at Santa Barbara

External person

Jiarui Gong

  • University of Wisconsin Madison, Madison, Wisconsin, UNITED STATES.

External person

Hao-Chung Kuo

  • National Yang Ming Chiao Tung University

External person

Marat Lutfullin

  • Quantum Solutions, 1 Venture Road, Southampton Science Park, UK

External person

Kalani Moore

  • University of Limerick

External person

Arash Pourhashemi

  • University of California at Santa Barbara

External person

Lutfan Sinatra

  • Quantum Solutions, 1 Venture Road, Southampton Science Park, UK

External person

Alain Goriely

  • University of Oxford

External person

Lafi M. Alanazi

  • King Abdulaziz City for Science and Technology

External person

P. A. van Aken

  • Max Planck Institute for Intelligent Systems

External person

E. Tangdiongga

  • Eindhoven University of Technology
  • Faculty of Electrical Engineering

External person

Victor M. Burlakov

  • University of Oxford

External person

E. Dogheche

  • Universite des Sciences et Technologies de Lille
  • Institute of Electronics, Microelectronics and Nanotechnology IEMN
  • Université de Lille

External person

Abdelmajid Salhi

  • King Abdulaziz City for Science and Technology

External person

Saleh T. Mahmoud

  • United Arab Emirates University

External person

Ming Zhou

  • University of Wisconsin-Madison

External person

Meshal Alawein

  • University of California at Berkeley

External person

Toshihiro Maki

  • The University of Tokyo,Institute of Industrial Science,Tokyo,Japan
  • The University of Tokyo

External person

Jianchang Yan

  • Chinese Academy of Sciences

External person

Tae-Hoon Chung

  • Light Source Research Division, Korea Photonics Technology Institute (KOPTI), Gwangju 61007, Republic of Korea.
  • Korea Photonics Technology Institute

External person

Lyu Zhou

  • University of Texas at Dallas
  • SUNY Buffalo
  • King Abdullah University of Science and Technology
  • University at Buffalo

External person

Asma O. Al Ghaithi

  • Department of Physics, College of Science, United Arab Emirates University, Al Ain 15551, UAE

External person

Mohamed Shehata

  • King Abdulaziz City for Science and Technology

External person

Jiaming Lin

  • Zhejiang University

External person

Nan Zhang

  • Texas A&M University
  • Electrical Engineering Department University at Buffalo The State University of New York Buffalo 14260NY
  • SUNY Buffalo
  • Shanghai Jiao Tong University
  • Sichuan University
  • King Abdullah University of Science and Technology

External person

Sohailh Marie

  • King Abdullah University of Science and Technology

External person

Yinaer Ha

  • Fudan University

External person

Leonidas Tsetseris

  • National Technical University of Athens

External person

M. Benaissa

  • Mohammed V University in Rabat

External person

P. Bhattacharya

  • University of Michigan, Ann Arbor

External person

Sehwa Chun

  • The University of Tokyo,Institute of Industrial Science,Tokyo,Japan
  • The University of Tokyo

External person

Dimitrios Kaltsas

  • National Technical University of Athens

External person

Donghyeok Kim

  • University of Wisconsin Madison, Madison, Wisconsin, UNITED STATES.

External person

Qiaoqiang Gan

  • Department of Electrical Engineering; The State University of New York at Buffalo; Buffalo NY 14260 USA

External person

Thomas Frost

  • University of Michigan, Ann Arbor

External person

Jeganathan Kulandaivel

  • Bharathidasan University
  • Centre for Nanoscience and Nanotechnology

External person

Munir El-desouki

  • King Abdulaziz City for Science and Technology

External person

Muhammad Shafa

  • United Arab Emirates University

External person

C. Y. Ngo

  • Nanyang Technological University
  • School of Electrical and Electronic Engineering (Block S1)
  • School of Electrical and Electronic Engineering
  • Sch. of Elec. and Electron. Eng.

External person

Y. K. Sim

  • Nanyang Technological University
  • School of Electrical and Electronics Engineering
  • School of Electrical and Electronic Engineering
  • Sch. of Elec. and Electron. Eng.

External person

Paulraj Gnanasekar

  • Bharathidasan University
  • Centre for Nanoscience and Nanotechnology
  • King Abdullah University of Science and Technology

External person

Ursel Bangert

  • Department of Physics, Bernal Institute, University of Limerick, Limerick V94 T9PX, Ireland

External person

Jisoo Kim

  • University of Wisconsin Madison, Madison, Wisconsin, UNITED STATES.

External person

W. Sigle

  • Max Planck Institute for Intelligent Systems

External person

Matthew Singer

  • King Abdullah University of Science and Technology
  • SUNY Buffalo
  • University at Buffalo

External person

Changyuan Yu

  • Hong Kong Polytechnic University

External person

Chisen Lee

  • University of Michigan, Ann Arbor

External person

Hicham Idriss

  • SABIC
  • University College London
  • King Abdullah University of Science and Technology

External person

Meng Tian

  • University of Bern

External person

Haochen Zhang

  • School of Microelectronics, University of Science and Technology of China, Hefei 230029, P.R. China

External person

Jichun Ye

  • Chinese Academy of Sciences

External person

Yu-Cheih Chi

  • National Taiwan University

External person

V. Rymanov

  • University of Duisburg-Essen
  • Zentrum für Halbleitertechnik und Optoelektronik (ZHO)
  • Zentrum für Halbleitertechnik und Optoelektronik

External person

A. Patra

  • University of Duisburg-Essen

External person

M. Zegaoui

  • Universite des Sciences et Technologies de Lille
  • Institute of Electronics, Microelectronics and Nanotechnology IEMN
  • Université de Lille

External person

Abdulrahman M. Albadri

  • King Abdulaziz City for Science and Technology

External person

Zongfu Yu

  • Stanford University
  • University of Wisconsin-Madison

External person

Huabin Yu

  • School of Microelectronics, University of Science and Technology of China, Hefei 230029, P.R. China

External person

T. Mei

  • Nanyang Technological University
  • Sch. of Elec. and Electron. Eng.
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronics Engineering

External person

Si-Young Bae

  • Korea Institute of Ceramic Engineering And Technology

External person

Takumi Matsuda

  • Meiji University,School of Science and Technology,Kanagawa,Japan
  • The University of Tokyo
  • Meiji University

External person

Kwangwook Park

  • National Renewable Energy Laboratory
  • Jeonbuk National University

External person

Yuki Sekimori

  • The University of Tokyo,Institute of Industrial Science,Tokyo,Japan
  • The University of Tokyo

External person

E. C. Young

  • University of California at Santa Barbara

External person

Bayan A. Alnahhas

  • King Abdulaziz City for Science and Technology

External person

Mounir Hamdi

  • Hamad bin Khalifa University

External person

Donghui Zhao

  • Lehigh University
  • Tsinghua University

External person

Kevin J. Chen

  • Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China

External person

Maria Gonzalez

  • Department of Electrical and Computer Engineering
  • Ohio State University
  • The Ohio State University

External person

Junxi Wang

  • Chinese Academy of Sciences

External person

Kai Wang

  • Institut national de recherche en informatique et en automatique
  • CNRS
  • Gipsa-lab.
  • Project ALICE

External person

Fangzhou Liang

  • School of Microelectronics, University of Science and Technology of China, Hefei, Anhui, 230026,China

External person

Anthony Aiello

  • University of Michigan, Ann Arbor

External person

M. M. El-Desouki

  • King Abdulaziz City for Science and Technology

External person

Yiming Li

  • Fudan University

External person

Xin Liu

  • Dalian University of Technology

External person

Yew Kuok Chuin

  • Nanyang Technological University
  • Sch. of Elec. and Electron. Eng.

External person

Chul Kang

  • Gwangju Institute of Science and Technology

External person

L. P. Khoo

  • Nanyang Technological University

External person

Hannah J. Joyce

  • University of Oxford

External person

Giuseppe Bernardo Consiglio

  • King Abdullah University of Science and Technology

External person

S. Faci

  • Sorbonne Université
  • Laboratoire d'Electronique et Electromagnétisme
  • LOBB

External person

Danhao Wang

  • School of Microelectronics, University of Science and Technology of China, Hefei 230029, P.R. China

External person

Shuoyang Qiu

  • Department of Electrical and Computer Engineering, University of Wisconsin-Madison 1 , Madison, Wisconsin 53706, USA

External person

J. S. Speck

  • University of California at Santa Barbara

External person

Jiangnan Dai

  • Huazhong University of Science and Technology

External person

Chen Xu

  • Luoyang Normal University

External person

Liang Li

  • National Institute for Materials Science Tsukuba
  • International Center for Materials Nanoarchitectonics (MANA)

External person

Li Chen

  • Tsinghua University
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Moheb Sheikhi

  • Chinese Academy of Sciences
  • University of Chinese Academy of Sciences
  • Ningbo Institute of Materials Technology and Engineering (NIMTE)
  • Chinese Academy of Sciences

External person

Yee Chia Yeo

  • National University of Singapore
  • Department of Electrical and Computer Engineering

External person

Wael Alghamdi

  • Harvard University

External person

Jae Hyun Ryou

  • University of Houston
  • Georgia Institute of Technology
  • Department of Mechanical Engineering
  • Center for Compound Semiconductors
  • Department of Mechanical Engineering
  • Texas Center for Superconductivity at the University of Houston (TcSUH)

External person

S. Jahangir

  • University of Michigan, Ann Arbor

External person

Abdulrahman Albadri

  • King Abdulaziz City for Science and Technology

External person

Hock Chun Chin

  • National University of Singapore
  • Department of Electrical and Computer Engineering

External person

Michele (Shelly) Conroy

  • Department of Physics, Bernal Institute, University of Limerick, Limerick V94 T9PX, Ireland

External person

Bandar Alshehri

  • Universite des Sciences et Technologies de Lille

External person

Hao Chung Kuo

  • National Yang Ming Chiao Tung University
  • National Taiwan University
  • Institute of Electro-Optical Engineering
  • Department of Photonics
  • Department of Electrical Engineering
  • Hon Hai Precision Industry

External person

Wang Shanzhong

  • Nanyang Technological University
  • Sch. of Elec. and Electron. Eng.

External person

Hoon Eui Jeong

  • University of California at Berkeley
  • Korea Photonics Technology Institute

External person

Dong Liu

  • Tsinghua University

External person

Houqiang Xu

  • Chinese Academy of Sciences
  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Justin D. Holmes

  • University College Cork

External person

Yangjian Lin

  • Institute of Physical Science and Information Technology, Anhui University, Hefei 230029, P.R. China

External person

Jongmin Kim

  • Korea Advanced Nano Fab Center, Suwon, Gyeonggi-do 16229, Republic of Korea

External person

Didier Decoster

  • Universite des Sciences et Technologies de Lille

External person

Fabian Finkbeiner

  • King Abdullah University of Science and Technology

External person

Mohamed Abdallah

  • College of Science and Engineering
  • Hamad bin Khalifa University

External person

Xiao Wei Sun

  • Nanyang Technological University
  • Tianjin University
  • Southern University of Science and Technology
  • National University of Singapore
  • School of Electrical and Electronic Engineering
  • Department of Applied Physics
  • Division of Physics and Applied Physics
  • Department of Materials Science and Engineering
  • Sch. of Elec. and Electron. Eng.
  • University of Science and Technology
  • Department of Electrical and Electronic Engineering
  • Sch. of Elec. and Electron. Eng.
  • School of Electrical and Electronics Engineering
  • Tianjin Key Laboratory of Low Dimensional Materials Physics and Processing Technology
  • Department of Applied Physics
  • Department of Materials Science and Engineering
  • Luminous! Center of Excellence for Semiconductor Lighting and Displays
  • School of Physical and Mathematical Sciences

External person

Z. X. Shen

  • Nanyang Technological University
  • National University of Singapore
  • Division of Physics and Applied Physics
  • Department of Physics
  • School of Physical and Mathematical Sciences
  • Department of Materials Science and Engineering
  • Sch. of Elec. and Electron. Eng.
  • Centre for Disruptive Photonic Technologies (CDPT)
  • Department of Physics
  • Department of Materials Science
  • School of Electrical and Electronic Engineering
  • Department of Materials Science and Engineering
  • Centre for Disruptive Photonic Technologies
  • School of Physical and Mathematical Sciences
  • Nanjing University of Posts and Telecommunications

External person

Mitchell A. Cox

  • University of the Witwatersrand

External person

John O'Connell

  • University College Cork

External person

K. Radhakrishnan

  • Nanyang Technological University
  • Microelectronics Center
  • School of Electrical and Electronic Engineering
  • Microelectronic Center
  • Microelectronics Centre

External person

Ahmed Bukhamseen

  • Saudi Aramco

External person

Nacir Tit

  • United Arab Emirates University
  • Physics Department

External person

Yi Pan

  • Xi'an Jiaotong University

External person

L. H. Tan

  • Agency for Science, Technology and Research, Singapore
  • Institute of Microelectronics

External person

Young Jin Yoo

  • Gwangju Institute of Science and Technology

External person

Dan-Hua Hsieh

  • National Yang Ming Chiao Tung University

External person

C. H. Tung

  • Agency for Science, Technology and Research, Singapore
  • Institute of Microelectronics

External person

Cheng Ting Tsai

  • National Taiwan University

External person

L. H. Lin

  • National Chiayi University

External person

Jianbin Xiang

  • Fudan University
  • Department of General Surgery

External person

Bing Xu

  • Brandeis University

External person

Arnab Hazari

  • University of Michigan, Ann Arbor

External person

Fan Weijun

  • Nanyang Technological University

External person

C. S. Lee

  • University of Michigan, Ann Arbor

External person

Yang Yue

  • Institute of Physical Science and Information Technology, Anhui University, Hefei 230029, P.R. China

External person

José Ramón Durán Retamal

  • King Abdullah University of Science and Technology
  • National Taiwan University

External person

Semi Oh

  • Gwangju Institute of Science and Technology

External person

Renad A. Aljefri

  • King Abdullah University of Science and Technology

External person

Y. Ochiai

  • Chiba University

External person

Michael Cantore

  • University of California Office of the President

External person

Yong-Hyeon Kim

  • Energy and Environmental Division, Korea Institute of Ceramic Engineering and Technology, Jinju 52851, Korea

External person

A. J. Pitera

  • Massachusetts Institute of Technology
  • Massachusetts Inst. of Technology
  • United States Department of Energy
  • Department of Materials Science and Engineering
  • Massachusetts Institute of Technology

External person

J. T. Leonard

  • University of California at Santa Barbara

External person

Abdul Rahman

  • King Abdulaziz City for Science and Technology

External person

Jenhwa GUO

  • National Taiwan University

External person

C. Tripon-Canseliet

  • Sorbonne Université
  • Laboratoire d'Electronique et Electromagnétisme
  • LOBB

External person

S. P. Denbaars

  • University of California at Berkeley
  • Department of Electrical and Computer Engineering, University of California, Santa arbara, CA, 93106, United States

External person

Long Jiang

  • North Dakota State University

External person

Karthik Peramaiah

  • King Abdullah University of Science and Technology

External person

Gong Ru Lin

  • Graduate Institute of Photonics and Optoelectronics, Department of Electrical Engineering, National Taiwan University (NTU)
  • National Taiwan University
  • Institute of Photonics and Optoelectronics
  • Institute of Photonics and Optoelectronics
  • Graduate Institute of Photonics and Optoelectronics
  • Department of Electrical Engineering
  • Taiwan University

External person

R. El Bouayadi

  • Mohamed I University

External person

Jong-Hyeob Baek

  • Light Source Research Division, Korea Photonics Technology Institute (KOPTI), Gwangju 61007, Republic of Korea.

External person

Erin C. Young

  • University of California at Santa Barbara
  • Materials Department
  • University of California

External person

Yijun Dai

  • Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, Zhejiang, China.
  • University of Chinese Academy of Sciences, Beijing, 100049, China.
  • CAS - Ningbo Institute of Material Technology and Engineering
  • University of Chinese Academy of Sciences

External person

John T. Leonard

  • University of California at Santa Barbara
  • Materials Department
  • University of California

External person

C.-S. Lee

  • University of Michigan, Ann Arbor

External person

M. Weiß

  • University of Duisburg-Essen

External person

E. A. Alkhazraji

  • King Fahd University of Petroleum and Minerals

External person

Jeehwan Kim

  • Massachusetts Institute of Technology

External person

Salman Al-Brahim

  • Office of the Ministry of Environment, Kingdom of Saudi Arabia

External person

M.T.A. Khan

  • King Fahd University of Petroleum and Minerals

External person

Zhongjie Ren

  • King Abdullah University of Science and Technology

External person

A. Malcoci

  • University of Duisburg-Essen

External person

Jinmin Li

  • Chinese Academy of Sciences

External person

T. Matsusue

  • Chiba University

External person

S. P. McAlister

  • National Research Council of Canada
  • Institute for Microstructural Sciences

External person

Ayan Das

  • University of Michigan, Ann Arbor

External person

Hong Yang

  • Nanyang Technological University
  • Microelectronic Center

External person

D. H. Zhang

  • Nanyang Technological University
  • School of Electrical and Electronic Engineering
  • Sch. of Elec. and Electron. Eng.

External person

I. Benabdallah

  • LaMCScI, Faculty of Sciences, Mohammed V University of Rabat, P.O. Box 1014, 10000 Rabat, Morocco.

External person

Choun Pei Wong

  • Nanyang Technological University
  • Division of Physics and Applied Physics
  • School of Physical and Mathematical Sciences

External person

Sun Zhongzhe

  • Nanyang Technological University
  • Sch. of Elec. and Electron. Eng.

External person

Changqing Chen

  • Huazhong University of Science and Technology
  • Xiamen University
  • Department of Orthopaedic Surgery

External person

Kuang-Hui Li

  • Photonics Laboratory, Computer, Electrical and Mathematical Science and Engineering Division (CEMSE)

External person

Jong Hyun Kim

  • Department of Molecular Science and Technology, Ajou University, Suwon 16499, Republic of Korea.

External person

Zihui Zhang

  • Hebei University of Technology

External person

Ahmed Bukhamsin

  • Saudi Aramco

External person

B. S. Ma

  • Nanyang Technological University
  • School of Electrical and Electronic Engineering
  • Sch. of Elec. and Electron. Eng.

External person

B. P. Yonkee

  • University of California at Santa Barbara

External person

Hong Wang

  • Nanyang Technological University
  • Microelectronic Center

External person

J. Y. Zhu

  • United States Department of Agriculture

External person

Hexiang Yuan

  • Tongji University

External person

Md Hosne Mobarok Shamim

  • King Fahd University of Petroleum and Minerals

External person

D. A. Cohen

  • University of California at Santa Barbara

External person

It Ee Lee

  • Multimedia University

External person

Kyoung-Ho Kim

  • Energy and Environmental Division, Korea Institute of Ceramic Engineering and Technology, Jinju 52851, Korea
  • Department of Materials Science and Engineering, Pusan National University, Busan 46241, Korea

External person

Himanshu Jain

  • Lehigh University

External person

Haodong Tang

  • Southern University of Science and Technology

External person

T. Margalith

  • University of California at Santa Barbara

External person

Sung Hoon Jung

  • Light Source Research Division, Korea Photonics Technology Institute (KOPTI), Gwangju 61007, Republic of Korea.

External person

H. Idriss

  • University of Aberdeen
  • University College London
  • SABIC
  • King Abdullah University of Science and Technology
  • Department of Chemistry and the London Centre for Nanotechnology

External person

Steven P. Den Baars

  • Materials Department, University of CaliforniaSanta Barbara, CA, United States

External person

Mansour Al-Bagshi

  • Deputy-Ministry for Environment, Ministry of Environment, Water and Agriculture, Riyadh, Saudi Arabia

External person

Mei Cui

  • Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, Zhejiang, China.
  • University of Chinese Academy of Sciences, Beijing, 100049, China.

External person

Xu Zhang

  • CAS - Wuhan Institute of Physics and Mathematics
  • Zhengzhou University
  • King Abdullah University of Science and Technology
  • Beijing University of Chemical Technology

External person

Nour El I Boukortt

  • Electronics and Communication Engineering Department, Kuwait College of Science and Technology, Doha 13113, Kuwait

External person

Jiean Jiang

  • Ningbo Institute of Materials Technology and Engineering (NIMTE)
  • Chinese Academy of Sciences
  • University of Chinese Academy of Sciences

External person

Shihao Ding

  • Southern University of Science and Technology

External person

Huai Yung Wang

  • National Taiwan University

External person

Yu Chieh Chi

  • National Taiwan University
  • Graduate Institute of Photonics and Optoelectronics, Department of Electrical Engineering, National Taiwan University (NTU)
  • Department of Electrical Engineering

External person

Yeong Jae Kim

  • Gwangju Institute of Science and Technology

External person

Yiming Zhou

  • Fudan University
  • Department of General Surgery

External person

S. J. Chua

  • Agency for Science, Technology and Research, Singapore
  • National University of Singapore
  • Inst of Materials Research and
  • Institute of Materials Research and Engineering
  • Nanyang Technological University

External person

Depeng Li

  • Southern University of Science and Technology

External person

Jamie D. Phillips

  • University of Michigan, Ann Arbor

External person

J. A. Gupta

  • National Research Council of Canada
  • Institute for Microstructural Sciences

External person

Yujie Xiong

  • University of Science and Technology of China

External person

Xiaodong Gu

  • Fudan University

External person

Junseok Heo

  • University of Michigan, Ann Arbor

External person

O. Ecin

  • University of Duisburg-Essen

External person

Robert M. Farrell

  • University of California Office of the President

External person

Kuangye Lu

  • Massachusetts Institute of Technology

External person

Daniel Vincent

  • Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA

External person

Seong-Min Jeong

  • Energy and Environmental Division, Korea Institute of Ceramic Engineering and Technology, Jinju 52851, Korea

External person

Tae Yong Park

  • King Abdullah University of Science and Technology

External person

Yaping Zhang

  • Key Laboratory for Ultrafine Materials of Ministry of Education
  • East China University of Science and Technology

External person

Sang Eun Yoon

  • Light Source Research Division, Korea Photonics Technology Institute (KOPTI), Gwangju 61007, Republic of Korea.

External person

Meng Zhang

  • University of Michigan, Ann Arbor

External person

Hery S. Djie

  • Lehigh University
  • JDS Uniphase
  • Nanyang Technological University
  • Center for Optical Technologies
  • Center for Optical Technologies and Department of Electrical and Computer Engineering
  • United States Army Research Laboratory
  • Sch. of Elec. and Electron. Eng.
  • School of Electrical and Electronic Engineering
  • Photonics Research Group
  • Photonics Research Group
  • Department of Electrical Engineering
  • Lehigh University

External person

Seong Ho Cho

  • Korea Institute of Ceramic Engineering And Technology
  • Pusan National University

External person

Zheyang Zheng

  • Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China

External person

Wai Chye Cheong

  • Nanyang Technological University
  • Microelectronic Center

External person

Yang Kang

  • School of Microelectronics, University of Science and Technology of China, Hefei 230029, P.R. China

External person

Peter Parbrook

  • University College Cork

External person

James Speck

  • Materials Department, University of CaliforniaSanta Barbara, CA, United States

External person

Namchul Cho

  • Soonchunhyang University

External person

Karim Dogheche

  • Universite des Sciences et Technologies de Lille

External person

Yu-Chieh Chi

  • National Taiwan University

External person

Shi Fang

  • School of Microelectronics, University of Science and Technology of China, Hefei 230029, P.R. China

External person

Qian Li

  • University of Illinois at Urbana-Champaign

External person

S. Nakamura

  • University of California at Berkeley
  • Department of Electrical and Computer Engineering, University of California, Santa arbara, CA, 93106, United States

External person

Yi Zhang

  • ParisTech

External person

Zhongling Liu

  • School of Microelectronics, University of Science and Technology of China, Hefei 230029, P.R. China

External person

S. T. Ng

  • Nanyang Technological University

External person

Xiao Gong

  • National University of Singapore
  • Department of Electrical and Computer Engineering

External person

Jamie Phillips

  • University of Michigan, Ann Arbor

External person

Shibing Long

  • University of Science and Technology of China

External person

J. F. Lampin

  • Universite des Sciences et Technologies de Lille
  • Institute of Electronics, Microelectronics and Nanotechnology IEMN
  • Université de Lille

External person

S. Z. Wang

  • Nanyang Technological University

External person

Ran Long

  • School of Chemistry and Materials Science, University of Science and Technology of China, Hefei 230029, P.R. China

External person

Norani Muti Mohamed

  • Center of Innovative Nanostructures and Nanodevices
  • Universiti Teknologi Petronas

External person

Andrew M. Carlin

  • Ohio State University
  • Department of Electrical and Computer Engineering
  • The Ohio State University

External person

John Leonard

  • University of California at Santa Barbara

External person

Zainal Arif Burhanudin

  • Universiti Teknologi Petronas
  • Center of Innovative Nanostructures and Nanodevices
  • Department of Electrical and Electronic Engineering

External person

Bo Sun

  • Department of General Surgery
  • Fudan University

External person

Adrian K. Bayraktaroglu

  • University of Michigan, Ann Arbor

External person

Binghui Ge

  • CAS - Institute of Physics

External person

Amal AlAmri

  • Physics Department, Collage of Science & Arts, King Abdulaziz University, Rabigh 25724, Saudi Arabia

External person

Abdullah A. Alhamoud

  • Advanced Photonics Laboratory
  • King Abdulaziz City for Science and Technology

External person

Gayathri Palanichamy

  • Centre for Nanoscience and Nanotechnology, Department of Physics, Bharathidasan University, Tiruchirappalli 620024, Tamil Nadu, India

External person

Steve A. Ringel

  • Ohio State University
  • Department of Electrical and Computer Engineering
  • The Ohio State University

External person

Meiwei Kong

  • Tongji University

External person

Zetian Mi

  • Department of Electrical Engineering and Computer Science, University of Michigan, 1301 Beal Avenue, Ann Arbor, Michigan 48109, United States

External person

Young Min Song

  • Gwangju Institute of Science and Technology

External person

Adrian Bayraktaroglu

  • University of Michigan, Ann Arbor

External person

Ming-Yang Li

  • Academia Sinica

External person

Ranveer Singh

  • Department of Electrical and Computer Engineering, University of Wisconsin-Madison 1 , Madison, Wisconsin 53706, USA

External person

Steevy J. Cordette

  • Technology Innovation Institute

External person

Jae-Seong Lee

  • School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology, Gwangju 61005, South Korea

External person