Wafer bonding system

  • Gheorghe Iordache (Manager)
Nanofabrication Core Lab

Equipment/facility: Equipment

  • LocationShow on map

    King Abdullah University of Science and Technology Thuwal 23955

    Saudi Arabia

Equipments Details

Description

Instrument to perform bonding and hot embossing on a wafer. 
Model: 520IS

Details

NameWafer bonding system
Acquisition date04/1/10
ManufacturersEV Group (EVG)

Contact Information

EmailsCoreLabs.Services@KAUST.EDU.SA
Web addressesUnspecified, Website

Equipment hierarchy

Laboratory - Nanofabrication
Wafer bonding system

Terms of loan/booking

Available for loan - internal only

Photo associated with equipment - BON_001_Semi_Automated_wafer_Bonding_system.jpg

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