Wafer bonding system

  • Gheorghe Iordache (Manager)

Equipment/facility: Equipment

  • LocationShow on map

    King Abdullah University of Science and Technology Thuwal 23955

    Saudi Arabia

Equipments Details

Description

Instrument to perform bonding and hot embossing on a wafer. 
Model: 520IS

Details

NameWafer bonding system
Acquisition date04/1/10
ManufacturersEV Group (EVG)
Photo associated with equipment - BON_001_Semi_Automated_wafer_Bonding_system.jpg

Fingerprint

Explore the research areas in which this equipment has been used. These labels are generated based on the related outputs. Together they form a unique fingerprint.