EVG6200∞ Automated Mask Alignment System

The EVG6200∞ Alignment System is optimized for highest throughput, highest mean time between failures and most accurate print gap settings. It accommodates wafers and substrates up to 200 mm, varying in size, shape and thickness. Equipped with EV Group's new NanoAlign Technology, the EVG6200∞ improves competitiveness of full-field lithography by providing the industry´s highest alignment accuracy and resolution at lowest cost of ownership. With full field proximity exposure of very thick resist layers, the EVG6200∞ targets wafer bumping and chip scale packaging markets as well as applications in MEMS, Compound Semiconductor, Power Devices and Nanotechnology.