US Patent Issued to Tsinghua University, HON HAI PRECISION INDUSTRY on Feb. 18 for "Three-dimensional porous composite structure" (Chinese Inventors)

    Press/Media: Press / Media

    PeriodFeb 19 2020

    Media coverage

    1

    Media coverage

    • TitleUS Patent Issued to Tsinghua University, HON HAI PRECISION INDUSTRY on Feb. 18 for "Three-dimensional porous composite structure" (Chinese Inventors)
      Media name/outletUS Fed News
      Country/TerritoryUnited States
      Date02/19/20
      PersonsZhen Li
    View all 1
    View less