US Patent Issued to Tsinghua University, HON HAI PRECISION INDUSTRY on Nov. 24 for "Method for making nanoporous copper" (Chinese Inventors)

    Press/Media: Press / Media

    PeriodNov 25 2020

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    Media coverage

    • TitleUS Patent Issued to Tsinghua University, HON HAI PRECISION INDUSTRY on Nov. 24 for "Method for making nanoporous copper" (Chinese Inventors)
      Media name/outletUS Fed News
      Country/TerritoryUnited States
      Date11/25/20
      PersonsZhen Li
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