US Patent Issued to TEXAS INSTRUMENTS on Nov. 15 for "Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip" (Japanese, American Inventors)

Media coverage

• Title	US Patent Issued to TEXAS INSTRUMENTS on Nov. 15 for "Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip" (Japanese, American Inventors)
  Media name/outlet	US Fed News
  Country/Territory	United States
  Date	11/15/22
  URL	ct.moreover.com/?a=49264196117&p=1gw&v=1&x=KH425tj14mQPlAenNNJH0g
  Persons	Benjamin Cook