US Patent Issued to HERE Global on Jan. 21 for "Method, apparatus and computer program product for mapping and modeling a three dimensional structure" (Illinois Inventors)

Press/Media: Press / Media

PeriodJan 29 2020

Media coverage

1

Media coverage

  • TitleUS Patent Issued to HERE Global on Jan. 21 for "Method, apparatus and computer program product for mapping and modeling a three dimensional structure" (Illinois Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date01/29/20
    PersonsBing Li
View all 1
View less