A Flip-Chip, Co-Packaged With Photodiode, High-speed TIA in 16nm FinFET CMOS

Press/Media: Press / Media

Period	Jul 20 2023

Media coverage

Title	A Flip-Chip, Co-Packaged With Photodiode, High-speed TIA in 16nm FinFET CMOS
Media name/outlet	Semiconductor Engineering
Country/Territory	United States
Date	07/20/23
URL	https://semiengineering.com/a-flip-chip-co-packaged-with-photodiode-high-speed-tia-in-16nm-finfet-cmos/
Persons	Tony Chan